Datasheet

2003 Oct 14 14
Philips Semiconductors Product specification
High speed CAN transceiver TJA1040
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Hot bar or manual soldering is suitable for PMFP packages.
REVISION HISTORY
PACKAGE
(1)
SOLDERING METHOD
WAVE REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, SSOP-T
(3)
, TFBGA, VFBGA not suitable suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not suitable
(4)
suitable
PLCC
(5)
, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP not recommended
(7)
suitable
PMFP
(8)
not suitable not suitable
REV DATE CPCN DESCRIPTION
6 20031014 200307014 Product specification (9397 750 11837)
Modification:
• Change ‘V
th(dif)
= 0.5 V’ in standby mode into ‘V
dif(th)
= 0.4 V’
• Add Chapter REVISION HISTORY
5 20030219 − Product specification (9397 750 10887)