Datasheet

2003 Oct 22 13
Philips Semiconductors Product specification
High speed CAN transceiver TJA1050
BONDING PAD LOCATIONS
Note
1. All x/y coordinates represent the position of the centre
of each pad (in µm) with respect to the lefthand bottom
corner of the top aluminium layer (see Fig.13).
SYMBOL PAD
COORDINATES
(1)
xy
TXD 1 103 103
GND 2 740 85
V
CC
3 886.5 111
RXD 4 1371.5 111
V
ref
5 1394 1094
CANL 6 998 1115
CANH 7 538.5 1115
S 8 103 1097
Fig.13 Bonding pad locations.
handbook, halfpage
MGS381
8
TJA1050U
765
1
23 4
y
x
0
0
test pad
The backside of the bare die must be connected to ground.