Datasheet

UBA2037_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 October 2008 10 of 14
NXP Semiconductors
UBA2037
Full bridge control IC for HID general lighting
11. Package outline
Fig 5. Package outline SO24 (SOT137-1)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
Q
Z
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
c
L
v M
A
13
(A )
3
A
y
0.25
075E05 MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.61
0.60
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
e
1
0 5 10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
99-12-27
03-02-19