Datasheet

3
B3SLB3SL
• Using the Switch in an outdoor environment where it is ex-
posed to water drops for an extended period of time
• Using the Switch in an underwater setting where it is sub-
ject to strong water pressure.
Operation
• Do not repeatedly operate the Switch with excessive force.
Applying excessive pressure or applying additional force after
the plunger has stopped may deform the disk spring of the
Switch, resulting in malfunction.
• Be sure to set up the Switch so that the plunger will operate in a
straight vertical line.
If the plunger is pressed of-center or from an angle it may cause
deformation or damage to some parts. This may result in deteri-
oration of durability or malfunction.
Electrical Standards
Use the Switch within the rated voltage and current ranges, other-
wise the Switch may have a shortened life expectancy, radiate
heat, or burn out. This particularly applies to the instantaneous
voltages and currents when switching.
Soldering
Soldering Precautions
1. Before any kind of soldering, test to confirm that soldering
can be performed properly. Otherwise the Switch may be
deformed by the soldering heat depending on the type of
PCB, pattern, or lands of the PCB.
2. Do not solder the Switch more than twice, including rectifi-
cation soldering. Wait for at least five minutes between the
first and second soldering to allow the temperature to return
to normal. Continuous soldering may cause the casing to
melt or deteriorate the Switch characteristics.
Reflow Soldering Conditions
Firmly attach a thermocouple to the surface of the terminals with
solder that has a high melting point and set the reflow oven so
that the peak temperature of the terminals is 260°C or less.
The following figure shows the temperature profile.
Manual Soldering
1. Soldering temperature: 350°C max. at the tip of the solder-
ing iron
2. Soldering time: 3 s max. for a 1.6-mm thick, single-side
PCB
Washing
Standard Switches are not sealed, and cannot be washed.
Doing so will cause the washing agent, together with flux or dust
particles on the PCB, to enter the Switch, resulting in malfunction.
PCBs
The Switch is designed for a 1.6-mm thick, single-side PCB.
Using PCBs with a different thickness or using double-sided,
through-hole PCBs may result in loose mounting, improper inser-
tion, or poor heat resistance in soldering. These effects will occur,
depending on the type of holes and patterns of the PCB. There-
fore, it is recommended that a verification test is conducted before
use.
RoHS Compliant
The "RoHS Compliant" designation indicates that the listed mod-
els do not contain the six hazardous substances covered by the
RoHS Directive.
Reference:
The following standards are used to determine compliance for the
six substances.
Lead: 1,000 ppm max.
Mercury: 1,000 ppm max.
Cadmium: 100 ppm max.
Hexavalent chromium: 1,000 ppm max.
PBB: 1,000 ppm max.
PBDE: 1,000 ppm max.
Packaging Specifications
The packaging specifications for B3SL Switches in embossed
taping are given below.
B3SL-1002P
B3SL-1022P
Temperature
(°C)
180
220
260 max.
150
Preheating time
Main
heating
time
Time (s)
60 to 120 60 max.
Standards Conforms to JIS.
Package 2,000 Switches (B3SL-1002P)
1,400 Switches (B3SL-1022P)
Heat resistance 60°C for 24 hours (without deformation)
380
±2
dia.
13 dia.
Reel (Material: PS)
Label
(22)
Tape drawing
direction
4
±0.1
2
16
7.5
1.75
12
±0.1
1.5
+0.1
0
dia.
Tape drawing direction
(3.7)
380
±2
dia.
13 dia.
Reel (Material: PS)
Label
(22)
Tape drawing
direction
(5.3)
2
16
7.5
1.75
4
±0.1
12
±0.1
1.5
+0.1
0
dia.
Tape drawing direction