Datasheet

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Photomicrosensor (Transmissive)

EE-SX1321

Ultra-Compact Slot / SMD Type

(Slot width: 2 mm)

• PCB surface mounting type.

• High resolution with a 0.3-mm-wide aperture.

• Dual-channel output.

Ordering Information

Photomicrosensor

Ratings, Characteristics and Exterior Specifications

Absolute Maximum Ratings (Ta = 25°C)

*1. Refer to the temperature rating chart if the ambient temperature

exceeds 25°C.

*2. Duty ratio: 1%, Pulse width: 0.1 ms

*3. Complete soldering within 10 seconds for reflow soldering.

Exterior Specifications

Electrical and Optical Characteristics

(Ta = 25°C)

Note: Refer to the following timing diagram for tr and tf.

Be sure to read Safety Precautions on page 3.

Appearance

Sensing

method

Connecting

method

Sensing distance

Aperture size (H × W)

(mm)

Output type Model

Transmissive

(slot type)

SMT

Emitter

1.4

× 1.4

Detector

× 0.3 2ch

Phototransistor

(Dual-channel

output)

EE-SX1321

5.1

2 mm (slot width)

Item Symbol Rated value Unit

Emitter

Forward current IF 25 *1 mA

Pulse forward current IFP 100

*2 mA

Reverse voltage VR 5V

Detector

Collector-Emitter

voltage

CEO 12 V

Emitter-Collector

voltage

VECO 5V

Collector current

C 20 mA

Collector dissipation

C 75 *1 mW

Operating temperature

opr

-30

to +

*1 °C

Storage temperature

stg

-40

to +

*1 °C

Reflow soldering

temperature

sol 255 *3 °C

Connecting method Weight (g)

Material

Case

SMT 0.1 PPS

Item Symbol

Value

Unit Condition

MIN. TYP.

MAX.

Emitter

Forward voltage VF --- 1.1 1.3 V IF = 5 mA

Reverse current

R --- --- 10 AVR = 5 V

Peak emission

wavelength



P --- 940 --- nm IF = 20 mA

Detector

Light current

L1 150 --- 1500 A

F = 5 mA,

CE = 5 V

IL2 150 --- 1500 A

Dark current ID --- 10 100 nA

VCE = 10 V,

0 lx

Collector-Emitter

saturated voltage

(sat)

--- 0.1 0.4 V

F = 20 mA,

L = 50 A

Peak spectral

sensitivity

wavelength



P --- 900 --- nm VCE = 5 V

Rising time tr --- 19 --- s

CC = 5 V,

L = 100 ,

L = 500 A

Falling time tf --- 26 --- s

CC = 5 V,

L = 100 ,

L = 500 A

Input

Output

90%

10%

Output

Summary of content (6 pages)

PAGE 1
Photomicrosensor (Transmissive) EE-SX1321 Ultra-Compact Slot / SMD Type (Slot width: 2 mm) • PCB surface mounting type. • High resolution with a 0.3-mm-wide aperture. • Dual-channel output. Be sure to read Safety Precautions on page 3. Ordering Information Photomicrosensor Sensing method Appearance 4 4 Connecting method Sensing distance Aperture size (H × W) (mm) Output type Emitter 1.4 × 1.4 Transmissive (slot type) SMT 2 mm (slot width) Phototransistor (Dual-channel output) Detector 1 × 0.
PAGE 2
EE-SX1321 Engineering Data (Reference value) Fig 1. Forward Current vs. Collector Dissipation Temperature Rating Fig 2. Forward Current vs. Forward Voltage Characteristics (Typical) 120 60 Fig 3. Light Current vs. Forward Current Characteristics (Typical) 60 3,500 Ta = 25°C VCE = 5 V Ta = 25°C IF 40 20 40 30 20 0 -40 -20 0 20 40 60 Ambient temperature Ta (ºC) 80 0 500 0 0 0.2 0.4 0.6 0.8 1 1.2 Forward voltage VF (V) 1.4 1.6 1.8 Fig 5. Relative Light Current vs.
PAGE 3
EE-SX1321 Safety Precautions To ensure safe operation, be sure to read and follow the Instruction Manual provided with the Sensor. CAUTION Precautions for Correct Use Do not use the product in atmospheres or environments that exceed product ratings. This product is for surface mounting. Refer to Soldering Information, Storage and Baking for details. Dispose of this product as industrial waste. This product is not designed or rated for ensuring safety of persons either directly or indirectly.
PAGE 4
EE-SX1321 Tape and Reel Reel (Unit: mm) 21±0.8 dia. 2±0.5 13±0.2 dia. 80±1dia. 330±2 dia. Product name PHOTO MICROSENSOR Lot number Quantity Country of origin W1 = 13.5±1 W2 = 17.5±1 W1 W2 Tape (Unit: mm) 1.5 dia. E2 E1 C K K A Tape Pull-out direction Note: Direction of product packing is upper figure.
PAGE 5
EE-SX1321 Soldering Information Reflow soldering: Temperature profile Manual soldering The reflow soldering can be implemented in two times complying with the following diagram. All the temperatures in the product must be within the diagram. The manual soldering should not be applied to the products, otherwise the housing may be deformed and/or the Au plating may be peeled off by heat. Other notes 260°C max. 255°C Temperature (°C) 1 to 4°C/s 230°C 10 sec max. 150 to 180°C max.
PAGE 6
• Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product.