Datasheet

5
EE-SY193
Soldering Information
Reflow soldering: Temperature profile
1. The following soldering paste is recommended:
Melting temperature: 178 to 192°C
2. The recommended thickness of the metal mask for screen printing
is between 0.2 and 0.25 mm.
3. Set the reflow oven so that the temperature profile shown in the
following chart is obtained for the upper surface of the product
being soldered.
Manual soldering
1. Use “Sn 60” (60% tin and 40% lead) or solder with silver content.
2. Use a soldering iron of less than 25 W, and keep the temperature
of the iron tip at 300°C or below.
3. Solder each point for a maximum of three seconds.
4. After soldering, allow the product to return to room temperature
before handling it.
Storage
Storage conditions
To protect the product from the effects of humidity until the package
is opened, dry-box storage is recommended. If this is not possible,
store the product under the following conditions:
Temperature: 10 to 30°C
Humidity: 60% RH max.
Treatment after open
1. The product is packed in a humidity-proof envelope. Reflow
soldering must be done within 48 hours after opening the
envelope, during which time the product must be stored under
30°C at 80% maximum humidity.
2. If it is necessary to store the product after opening the envelope,
use dry-box storage or reseal the envelope.
Baking
If a product has remained packed in a humidity-proof envelope for six
months or more, or if more than 48 hours have lapsed since the
envelope was opened, bake the product under the following
conditions before use:
Reel: 60°C for 24 hours or more
Bulk: 80°C for 24 hours or more
10 sec. max.
220
° C max.
Time
60 to 120 sec
Temperature
4 ° C/s max.
40 sec. max.
4
° C/s max.
140 to 160
° C