Datasheet

5
G3VM SeriesG3VM Series
Load Connection
Do not short-circuit the input and output terminals while the relay
is operating or the relay may malfunction.
Solder Mounting
Perform solder mounting under the following recommended con-
ditions to prevent the temperature of the Relays from rising.
<Flow Soldering>
Through-hole Mounting (Once Only)
Note: We recommend that the suitability of solder mounting be
verified under actual conditions.
<Reflow Soldering>
Surface Mounting DIP or SOP Packages (Twice Max.)
Surface Mounting SSOP Packages (Twice Max.)
Note: 1. We recommend that the suitability of solder mounting
be verified under actual conditions.
2. Tape cut SSOPs are packaged without humidity resis-
tance. Use manual soldering to mount them.
Manual Soldering (Once Only)
Manually solder at 350
°C for 3 s or less or at 260°C for 10 s or
less.
SSOP Handling Precautions
<Humidity-resistant Packaging>
Component packages can crack if surface-mounted components
that have absorbed moisture are subjected to thermal stress
when mounting. To prevent this, observe the following precau-
tions.
1. Unopened components can be stored in the packaging at 5
to 30
°C and a humidity of 90% max., but they should be
used within 12 months.
2. After the packaging has been opened, components can be
stored at 5 to 30
°C and a humidity of 60% max., but they
should be mounted within 168 hours.
3. If, after opening the packaging, the humidity indicator turns
pink to the 30% mark or the expiration data is exceeded,
bake the components while they are still on the taping reel,
and use them within 72 hours. Do not bake the same com-
ponents more than once.
Baking conditions: 60
±5°C, 64 to 72 h
Expiration date: 12 months from the seal date
(given on the label)
4. If the same components are baked repeatedly, the tape
detachment strength will change, causing problems when
mounting. When mounting using dehumidifying measures,
always take countermeasures against component damage
from static electricity.
5. Do not throw or drop components. If the laminated packag-
ing material is damaged, airtightness will be lost.
6. Tape cut SSOPs are packaged without humidity resistance.
Use manual soldering to mount them.
AC Connection
DC Single Connection
DC Parallel Connection
Load
Load
Load
Load
Solder type Preheating Soldering
Lead solder
SnPb
150
°C
60 to 120 s
230 to 260°C
10 s max.
Lead-free solder
SnAgCu
150
°C
60 to 120 s
245 to 260°C
10 s max.
Solder type Preheating Soldering
Lead solder
SnPb
140
→160°C
60 to 120 s
210°C
30 s max.
Peak
240
°C max.
Lead-free solder
SnAgCu
180
→190°C
60 to 120 s
230°C
30 to 50 s
Peak
260
°C max.
Solder type Preheating Soldering
Lead solder
SnPb
140
→160°C
60 to 120 s
210°C
30 s max.
Peak
240
°C max.
Lead-free solder
SnAgCu
150
→180°C
120 s max.
230°C
30 s max.
Peak
250
°C max.