Brochure

27
Technical Information – Relays
Process 4: Preheating
Preheat the PCB at a temperature of 110˚C maximum within a period of approximately 40 seconds for smooth soldering. The
characteristics of the relay may change if it is heated at a high temperature for a long time.
Possibility of Preheating
Process 5: Soldering
Flow soldering is recommended to assure a uniform solder joint.
• Solder temperature and soldering time: 260˚C, 5 s max.
• Adjust the level of the molten solder so that the PCB is not flooded with solder.
Possibility of Automatic Soldering
Process 6: Cooling
Upon completion of automatic soldering, use a fan or other device to forcibly cool the PCB. This helps prevent the relay and other
components from deteriorating from the residual heat of soldering.
Fully sealed relays are washable. Do not, however, put fully sealed relays in a cold cleaning solvent immediately after soldering or the
seals may be damaged.
Complete the soldering operation quickly. Use the correct wattage of soldering
iron. Do not overheat while smoothing the applied solder with the tip of the iron.
• Solder: JIS Z3282, H60, or H63 (containing resin-type flux)
• Soldering iron: rated at 30 to 60 W
• Tip temperature: 280∞C to 300∞C
• Soldering time: 3 s max.
• The f
ollowing table contains recommended solders:
Type Sparkle solder
Applicable solder diameter 0.8 to 1.6 mm
Spread rate 90%
Storage 3 months max.
Solder
Flux
The solder in the illustration shown above is provided with a cut
section to prevent the flux from splattering.
Possibility of Manual Soldering
Unsealed Flux protection Fully sealed
YES YES YES
Manual Soldering
Unsealed Flux protection Fully sealed
NO YES YES
Flux protection Fully sealed
Necessary Necessary
Unsealed Flux protection Fully sealed
NO YES YES
110°C
Heater
PCB Relays
Omron A5 Catalogue 2007 1-282 11/9/06 10:16 am Page 27