Datasheet

Solid State Relays Common Precautions
■HANDLING THE SSR
●Do Not Drop
The SSR is a high-precision component. Do not drop the SSR or
su
bject it to excessive vibration or shock regardless of wheth
er
t
he SSR is mounted or not.
The maximum vibration and shock that an SSR can withst
and
v
aries with the model. Refer to the relevant datasheet.
The SSR cannot maintain its full performance capability if the
SSR is dropped or subjected to excessive vibration or shock.
In addition, it may result in malfunction due to its damag
ed
i
nternal components if the SSR is dropped or subjected t
o
e
xcessive vibration or shock.
The impact of shock given to the SSR that is dropped varies
upon the case. For example, if a single SSR is dropped on a
plastic tile from a height of 10 cm, the SSR may receive a shock
of 1,000 m/s
2
or more. (It depends on the floor material, the
angle of collision with the floor, and the dropping height.)
Handle the SSR models in stick packages with the same care
a
nd keep them free from excessive vibration or shock.
●Terminal arrangement/Internal connections
1. BOTTOM VIEW
If the relay's terminals cannot be seen from above, as in this
example, a BOTTOM VIEW
is shown.
2. Rotating direction to BOTTOM VIEW
The following shows the terminal rotated in the directio
n
indicated by the arrow, with the coil always on the left
(orientation mark on the left).
■PCB-mounting SSRs
1. Suitable PCBs
1 PCB Material
PCBs are classified into epoxy PCBs and phenol PCBs. The
following table lists the characteristics of these PCBs. Select
one, taking into account the application and cost. Epoxy PCBs
are recommended for SSR mounting in order to prevent the
solder from cracking.
2 PCB Thickness
The PCB may warp due to the size, mounting method, or
ambient operating temperature of the PCB or the weight of
components mounted to the PCB. Should warping occur, the
internal mechanism of the SSR on the PCB will be deformed
and the SSR may not provide its full capability. Determine the
thickness of the PCB by taking the material of the PCB into
consideration.
3 Terminal Hole and Land Diameters
Refer to the following table to select the terminal hole and land
diameters based on the SSR mounting dimensions. The land
diameter may be smaller if the land is processed with through-hole
plating.
2. Mounting Space
The ambient temperature around the sections where the SSR is
mount
ed must be within the permissible ambient operating
temperature. If two or more SSRs are mounted closely together,
the SSRs may radiate excessive heat. Therefore, make sure that
the
SSRs are separated from one another at the specifie
d
dis
tance provided in the datasheet. If there is no s
uch
specification, maintain a space that is as wide as a single SSR.
Pro
vide adequate ventilation to the SSRs as shown in t
he
f
ollowing diagram.
Axis of rotation
Material Epoxy Phenol
Item
Glass epoxy
(GE)
Paper epoxy
(PE)
Paper phenol
(PP)
Electrical
characteristics
x High insulation
resistance.
x Highly resistive to
moisture absorption.
x Inferior to glass
epoxy but
superior to paper
phenol PCBs.
x New PCBs are
highly insulation-
resistive but easily
affected by moisture
absorption and
cannot maintain
good insulation
performance over a
long time.
Mechanical
characteristics
x The dimensions are
not easily affected by
temperature or
humidity.
x Ideal for through-hole
or multi-layer PCBs.
x Inferior to glass
epoxy but
superior to paper
phenol PCBs.
x The dimensions are
easily affected by
temperature or
humidity.
x Not suitable for
through-hole PCBs.
Economical
efficiency
x Expensive x Rather expensive x Inexpensive
Application
x Applications that
require high
reliability.
x Applications that
may require less
reliability than
those for glass
epoxy PCBs but
require more
reliability than
those of paper
phenol PCBs.
x Applications in
comparatively good
environments with
low-density wiring.
Hole dia. (mm)
Minimum land dia. (mm)
Nominal value Tolerance
0.6
±0.1
1.5
0.8 1.8
1.0 2.0
1.2 2.5
1.3 2.5
1.5 3.0
1.6 3.0
2.0 3.0
Top
Bottom
Top
Bottom
Ventilation airflow
Ventilation airflow
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