Datasheet

837
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836
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Photomicrosensor-Transmissive – EE-SX1018
Features
■
Compact model with a 2-mm-wide slot.
■
PCB mounting type.
■
High resolution with a 0.5-mm-wide aperture.
Specifications
■
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Rated value
Emitter Forward current I
F
50 mA (see note 1)
Pulse foward current I
FP
1 A (see note 2)
Reverse Voltage V
R
4 V
Detector Collector-Emitter voltage V
CEO
30 V
Emitter-Collector voltage V
ECO
–
Collector current I
C
20 mA
Collector dissipation P
C
100 mW (see note 1)
Ambient temperature Operating Topr -25°C to 85°C
Storage Tstg -30°C to 100°C
Soldering temperature Tsol 260°C (see note 3)
Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25°C.
2. The pulse width is10µs maximum with a frequency of 100Hz.
3. Complete soldering within 10 seconds.
■
Electrical and Optical Characteristics (Ta = 25°C)
Item Symbol Value Condition
Emitter Forward voltage V
F
1.2 V typ., 1.5 V max. I
F
= 30 mA
Reverse current I
R
0.01 µA typ., 10 µA max. V
R
= 4 V
Peak emission wavelength λ
P
940 nm typ. I
F
= 20 mA
Detector Light current I
L
0.5 mA min., 14 mA max. I
F
= 20 mA, V
CE
= 10 V
Dark current I
D
2 nA typ., 200 nA max. V
CE
= 10 V, 0 x
Leakage current I
LEAK
––
Collector-Emitter saturated voltage V
CE
(sat) 0.1 V typ., 0.4 V max. I
F
= 20 mA, I
L
= 0.1 mA
Peak spectral sensitivity wavelength λ
P
850 nm typ. V
CF
= 10 V
Rising time tr 4 µs typ. V
CC
= 5 V, R
L
= 100 Ω, I
L
= 5 mA
Falling time tf 4 µs typ. V
CC
= 5 V, R
L
= 100 Ω, I
L
= 5 mA
Transmssive Photomicrosensors
Photomicrosensor-Transmissive – EE-SX1107/1108/1109/1131
ALL DIMENSIONS SHOWN ARE IN MILLIMETRES.
To convert millimetres into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.
Precautions
260°C max.
Time
120 sec
Temperature
1 to 5°C/s
150 to 180°C
40 sec max.
10 sec max.
1 to 5°C/s
255°C max.
230°C max.
■
Soldering Information
Reflow soldering
• The following soldering paste is recommended:
Melting temperature: 216 to 220°C
Composition: Sn 3.5 Ag, 0.75 Cu
• The recommended thickness of the metal mask for screen
printing is between 0.2 and 0.25 mm.
• Set the reflow oven so that the temperature profile shown in the
following chart is obtained for the upper surface of the product
being soldered.
Manual soldering
• Use “Sn 60” (60% tin and 40% lead) or solder with silver
content.
• Use a soldering iron of less than 25W, and keep the temperature
of the iron tip at 350°C or below.
• Solder each point for a maximum of three seconds.
• After soldering, allow the product to return to room temperature
before handling it.
Storage
To protect the product from the effects of humidity until the
package is opened, dry-box storage is recommended. If this is
not possible, store the product under the following conditions:
Temperature: 10 to 30°C
Humidity: 60% max.
The product is packed in a humidity-proof envelope. Reflow
soldering must be done within 48 hours after opening the
envelope, during which time the product must be stored under
30°C at 80% maximum humidity.
If it is necessary to store the product after opening the envelope,
use dry-box storage or reseal the envelope.
Baking
If a product has remained packed in a humidity-proof envelope for
six months or more, or if more than 48 hours have lapsed since
the envelope was opened, bake the product under the following
conditions before use:
Reel: 60°C for 24 hours or more
Bulk: 80°C for 4 hours or more
CAT. No. E904-E2-01A
Omron 08 Cat 774-995 5/10/07 16:04 Page 836