Data Sheet

© Semiconductor Components Industries, LLC, 2011
April, 2011 Rev. 8
1 Publication Order Number:
2N7000/D
2N7000G
Small Signal MOSFET
200 mAmps, 60 Volts
NChannel TO92
Features
AEC Qualified
PPAP Capable
This is a PbFree Device*
MAXIMUM RATINGS
Rating Symbol Value Unit
Drain Source Voltage V
DSS
60 Vdc
DrainGate Voltage (R
GS
= 1.0 MW)
V
DGR
60 Vdc
GateSource Voltage
Continuous
Nonrepetitive (t
p
50 ms)
V
GS
V
GSM
±20
±40
Vdc
Vpk
Drain Current
Continuous
Pulsed
I
D
I
DM
200
500
mAdc
Total Power Dissipation @ T
C
= 25°C
Derate above 25°C
P
D
350
2.8
mW
mW/°C
Operating and Storage Temperature
Range
T
J
, T
stg
55 to +150 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, JunctiontoAmbient
R
q
JA
357 °C/W
Maximum Lead Temperature for
Soldering Purposes, 1/16 from case
for 10 seconds
T
L
300 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
D
G
NChannel
S
1
Source
3
Drain
2
Gate
200 mAMPS
60 VOLTS
R
DS(on)
= 5 W
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
http://onsemi.com
MARKING DIAGRAM
AND PIN ASSIGNMENT
2N
7000
AYWW G
G
A = Assembly Location
Y = Year
WW = Work Week
G = PbFree Package
(Note: Microdot may be in either location)
1
2
3
1
2
BENT LEAD
TAPE & REEL
AMMO PACK
STRAIGHT LEAD
BULK PACK
3
TO92
CASE 29
STYLE 22

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