Data Sheet

FDC6327C
Electrical Characteristics
(continued)
T
A
= 25°C unless otherwise noted
S
y
mbol Parameter Test Conditions Type Min T
yp
Max Units
Switching Characteristics
(Note 2)
t
d(on)
Turn-On Delay Time N-Ch
P-Ch
5
7
15
14
ns
t
r
Turn-On Rise Time N-Ch
P-Ch
9
14
18
25
ns
t
d(off)
Turn-Off Delay Time N-Ch
P-Ch
12
14
22
25
ns
t
f
Turn-Off Fall Time
N-Channel
V
DD
= 10 V, I
D
= 1 A,
V
GS
= 4.5V, R
GEN
= 6
Ω
P-Channel
V
DD
= -10 V, I
D
= -1 A,
V
GS
= -4.5 V, R
GEN
= 6
Ω
N-Ch
P-Ch
3
3
9
9
ns
Q
g
Total Gate Charge N-Ch
P-Ch
3.25
2.85
4.5
4.0
nC
Q
gs
Gate-Source Charge N-Ch
P-Ch
0.65
0.68
nC
Q
gd
Gate-Drain Charge
N-Channel
V
DS
= 10 V, I
D
= 2.7 A, V
GS
= 4.5V
P-Channel
V
DS
= -10 V
,
I
D
= -1.9 A
,
V
GS
= -4.5V
N-Ch
P-Ch
0.90
0.65
nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain-Source Diode Forward Current N-Ch
P-Ch
0.8
-0.8
A
V
SD
Drain-Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= 0.8 A
(Note 2)
V
GS
= 0 V, I
S
= - 0.8 A
(Note 2)
N-Ch
P-Ch
0.76
-0.79
1.2
-1.2
V
Notes:
1: R
θJA
is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
R
θJC
is guaranteed by design while R
θJA
is determined by the user's board design. Both devices are assumed to be operating and sharing the dissipated heat energy
equally.
Scale 1 : 1 on letter size paper
2: Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
a) 130 °C/W when
mounted on a 0.125 in
2
pad of 2 oz. copper.
b) 140 °C/W when
mounted on a 0.005 in
2
pad of 2 oz. copper.
c) 180 °C/W when
mounted on a 0.0015 in
2
pad of 2 oz. copper.
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