Data Sheet

Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current Q1
0.8
A
Q2
–0.8
V
SD
Q1
V
GS
= 0 V, I
S
= 0.8 A (Note 2)
0.8 1.2
Drain–Source Diode Forward
Voltage
Q2
V
GS
= 0 V, I
S
= 0.8 A (Note 2)
0.8 –1.2
V
Notes:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 130 °C/W when
mounted on a 0.125
in
2
pad of 2 oz.
copper.
b) 140°/W when mounted
on a .004 in
2
pad of 2 oz
copper
c) 180°/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDC6333C
www.onsemi.com
3