Data Sheet

FSB50250UTD Motion SPM® 5 Series
©2013 Fairchild Semiconductor Corporation 6 www.fairchildsemi.com
FSB50250UTD Rev. C4
Figure 3. Recommended MCU Interface and Bootstrap Circuit with Parameters
3rd Notes:
1. Parameters for bootstrap circuit elements are dependent on PWM algorithm. For 15 kHz of switching frequency, typical example of parameters is shown above.
2. RC-coupling (R
5
and C
5
) and C
4
at each input of Motion SPM 5 product and MCU (Indicated as Dotted Lines) may be used to prevent improper signal due to surge-noise.
3. Bold lines should be short and thick in PCB pattern to have small stray inductance of circuit, which results in the reduction of surge-voltage. Bypass capacitors such as C
1
, C
2
and C
3
should have good high-frequency characteristics to absorb high-frequency ripple-current.
Figure 4. Case Temperature Measurement
3rd Notes:
4. Attach the thermocouple on top of the heat-sink of SPM 5 package (between SPM 5 package and heatsink if applied) to get the correct temperature measurement.
HIN LIN Output Note
0 0 Z Both FRFET Off
0 1 0 Low side FRFET On
10 V
DC High side FRFET On
1 1 Forbidden Shoot through
Open Open Z Same as (0,0)
COM
VCC
LIN
HIN
VB
HO
VS
LO
P
N
R
3
Inverter
Output
C
3
C
1
MCU
+15 V
10 F
These values depend on PWM control algorithm
* Example of Bootstrap Paramters:
C
1
= C
2
= 1 F Ceramic Capacitor
R
5
C
5
V
DC
C
2
VTS
* Example Circuit : V phase
C
4
V
One Leg Diagram of Motion SPM
®
5 Product
Case Temperature(Tc)
Detecting Point
14.50mm
3.80mm
MOSFET
Case Temperature(Tc)
Detecting Point
14.50mm
3.80mm
MOSFET