Datasheet

LM2931, NCV2931 Series
http://onsemi.com
3
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage Continuous V
I
40 Vdc
Transient Input Voltage (t ≤ 100 ms) V
I
(t)
60 Vpk
Transient Reverse Polarity Input Voltage
−V
I
(t)
−50− Vpk
1.0% Duty Cycle, t ≤ 100 ms
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM) Class 2, JESD22 A114−C
Machine Model (MM) Class A, JESD22 A115−A
Charged Device Model (CDM), JESD22 C101−C
−
−
−
2000
200
2000
V
V
V
Power Dissipation
Case 29 (TO−92 Type)
T
A
= 25°C P
D
Internally Limited W
Thermal Resistance, Junction−to−Ambient
R
q
JA
178 °C/W
Thermal Resistance, Junction−to−Case
R
q
JC
83 °C/W
Case 221A, 314A, 314B and 314D (TO−220 Type)
T
A
= 25°C P
D
Internally Limited W
Thermal Resistance, Junction−to−Ambient
R
q
JA
65 °C/W
Thermal Resistance, Junction−to−Case
R
q
JC
5.0 °C/W
Case 318H (SOT−223)
T
A
= 25°C P
D
Internally Limited W
Thermal Resistance, Junction−to−Ambient
R
q
JA
242 °C/W
Thermal Resistance, Junction−to−Case
R
q
JC
21 °C/W
Case 369A (DPAK) (Note 1)
T
A
= 25°C P
D
Internally Limited W
Thermal Resistance, Junction−to−Ambient
R
q
JA
92 °C/W
Thermal Resistance, Junction−to−Case
R
q
JC
6.0 °C/W
Case 751 (SOP−8) (Note 2)
T
A
= 25°C P
D
Internally Limited W
Thermal Resistance, Junction−to−Ambient
R
q
JA
160 °C/W
Thermal Resistance, Junction−to−Case
R
q
JC
25 °C/W
Case 936 and 936A (D
2
PAK) (Note 3)
T
A
= 25°C P
D
Internally Limited W
Thermal Resistance, Junction−to−Ambient
R
q
JA
70 °C/W
Thermal Resistance, Junction−to−Case
R
q
JC
5.0 °C/W
Operating Ambient Temperature Range T
A
−40 to +125 °C
Operating Die Junction Temperature T
J
+150 °C
Storage Temperature Range T
stg
−65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. DPAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 25 for board mounted Thermal Resistance.
2. SOP−8 Junction−to−Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 24 for Thermal Resistance
variation versus pad size.
3. D
2
PAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 26 for board mounted Thermal Resistance.
4. NCV rated devices are subjected to and meet the AECQ−100 quality standards.