Datasheet

MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G
http://onsemi.com
6
PACKAGE DIMENSIONS
SMC
CASE 403−03
ISSUE E
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.90 2.13 2.41 0.075
INCHES
A1 0.05 0.10 0.15 0.002
b 2.92 3.00 3.07 0.115
c 0.15 0.23 0.30 0.006
D 5.59 5.84 6.10 0.220
E 6.60 6.86 7.11 0.260
L 0.76 1.02 1.27 0.030
0.084 0.095
0.004 0.006
0.118 0.121
0.009 0.012
0.230 0.240
0.270 0.280
0.040 0.050
NOM MAX
7.75 7.94 8.13 0.305 0.313 0.320
H
E
4.343
0.171
3.810
0.150
2.794
0.110
ǒ
mm
inches
Ǔ
SCALE 4:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
bD
c
L1L
A1
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.
H
E
0.020 REF
0.51 REF
L1