Datasheet

NCL30082
http://onsemi.com
7
Table 3. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T
J
= 25°C, V
CC
= 12 V;
For min/max values T
J
= −40°C to +125°C, Max T
J
= 150°C, V
CC
= 12 V)
Description UnitMaxTypMinSymbolTest Condition
DIMMING SECTION
DIM pin voltage for zero output current (OFF voltage)
V
DIM(EN)
0.66 0.7 0.74 V
DIM pin voltage for maximum output current V
DIM100
2.25 2.45 2.65 V
Dimming range V
DIM(range)
– 1.75 – V
Clamping voltage for DIM pin V
DIM(CLP)
– 7.8 – V
Dimming pin pull−up current source I
DIM(pullup)
– 280 – nA
THERMAL FOLD−BACK AND OVP
SD pin voltage at which thermal fold−back starts
V
TF(start)
0.9 1 1.2 V
SD pin voltage at which thermal fold−back stops
(I
out
= 50% I
out(nom)
)
V
TF(stop)
0.64 0.68 0.72 V
Reference current for direct connection of an NTC (Note 5) I
OTP(REF)
80 85 90
mA
Fault detection level for OTP (Note 5) V
SD
decreasing V
OTP(off)
0.47 0.5 0.53 V
SD pin level at which controller re−start switching after OTP
detection
V
SD
increasing V
OTP(on)
0.64 0.68 0.72 V
Timer duration after which the controller is allowed to start
pulsing (Note 5)
t
OTP(start)
180 – 300
ms
Clamped voltage (SD pin left open) SD pin open V
SD(clamp)
1.13 1.35 1.57 V
Clamp series resistor R
SD(clamp)
– 1.6 –
kW
SD pin detection level for OVP V
SD
increasing V
OVP
2.35 2.5 2.65 V
Delay before OVP or OTP confirmation (OVP and OTP) T
SD(delay)
15 30 45
ms
THERMAL SHUTDOWN
Thermal Shutdown (Note 4)
Device switching
(F
SW
around 65 kHz)
T
SHDN
130 150 170 °C
Thermal Shutdown Hysteresis (Note 4) T
SHDN(HYS)
– 50 – °C
BROWN−OUT
Brown−Out ON level (IC start pulsing)
V
SD
increasing V
BO(on)
0.90 1 1.10 V
Brown−Out OFF level (IC shuts down) V
SD
decreasing V
BO(off)
0.85 0.9 0.95 V
BO comparators delay t
BO(delay)
– 30 –
ms
Brown−Out blanking time t
BO(blank)
35 50 65 ms
Brown−out pin bias current I
BO(bias)
−250 – 250 nA
4. Guaranteed by design
5. OTP triggers when R
NTC
= 4.7 kW