Data Sheet

©2004 Fairchild Semiconductor Corporation
RFD14N05L, RFD14N05LSM
Rev. C0
Typical Performance Curves Unless Otherwise Specified
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
TEMPERATURE
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY
T
C
, CASE TEMPERATURE (
o
C)
25 50 75 100
125
150
17
5
0
POWER DISSIPATION MULTIPLIER
0
0
0.2
0.4
0.6
0.8
1.0
1.2
8
4
0
25 50 75 100
125
150
12
I
D
, DRAIN CURRENT (A)
T
C
, CASE TEMPERATURE (
o
C)
16
17
5
t, RECTANGULAR PULSE DURATION (s)
10
-3
10
-2
10
-1
10
0
0.01
0.1
1
10
-5
10
1
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
θ
JC
x R
θ
JC
+ T
C
P
DM
t
1
t
2
SINGLE PULSE
0.01
0.02
0.05
0.1
0.2
0.5
10
-4
2
THERMAL IMPEDANCE
Z
θ
JC
, NORMALIZED
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
10
10
0
1
100
10
1
I
D
, DRAIN CURRENT (A)
DC
100µs
100ms
1ms
10ms
0.5
LIMITED BY r
DS(ON)
AREA MAY BE
OPERATION IN THIS
T
C
= 25
o
C
T
J
= MAX. RATED
t, PULSE WIDTH (s)
10
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
V
GS
= 10V
100
I
DM
, PEAK CURRENT CAPABILITY (A)
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
I = I
25
175 - T
C
150
FOR TEMPERATURES
ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
V
GS
= 5V
200
T
C
= 25
o
C
RFD14N05L, RFD14N05LSM