Data Sheet

©2002 Fairchild Semiconductor Corporation
RFP50N06 Rev. C0
Typical Performance Curves
Unless Otherwise Specified
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY
1.2
1.0
0.8
0.6
0.4
0.2
0
0 25 50 75 100 125 150 175
POWER DISSIPATION MULTIPLIER
T
C
, CASE TEMPERATURE (
o
C)
50
40
30
20
10
0
25 50 75 100 125 150 175
I
D
,
DRAIN CURRENT (A)
T
C
, CASE TEMPERATURE (
o
C)
60
1
0.1
0.01
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t
1
, RECTANGULAR PULSE DURATION (s)
P
DM
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
θJC
x R
θJC
+ T
C
SINGLE PULSE
t
1
t
2
THERMAL IMPEDANCE
Z
θJC
, NORMALIZED
0.01
0.02
0.05
0.1
0.2
0.5
2
400
100
10
1
1 10 100
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(ON)
1ms
100µs
10ms
100ms
DC
V
DSS(MAX)
= 60V
I
D
, DRAIN CURRENT (A)
T
C
= 25
o
C
T
J
= MAX RATED
SINGLE PULSE
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
10
4
10
2
10
3
t, PULSE WIDTH (ms)
V
GS
= 20V
V
GS
= 10V
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
FOR TEMPERATURES ABOVE 25
o
C
DERATE PEAK CURRENT
CAPABILITY AS FOLLOWS:
II
25
175 T
C
–
150
------------------------



=
I
DM
,
PEAK CURRENT (A)
40
T
C
= 25
o
C
RFP50N06