Datasheet

MCR106–6, MCR106–8
http://onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Case R
θJC
3.0 °C/W
Thermal Resistance, Junction to Ambient R
θJA
75 °C/W
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds T
L
260 °C
ELECTRICAL CHARACTERISTICS (T
C
= 25°C unless otherwise noted.)
Characteristic
Symbol
Min Typ Max Unit
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
(V
AK
= Rated V
DRM
or V
RRM
; R
GK
= 1000 Ohms) T
J
= 25°C
T
J
= 110°C
I
DRM
, I
RRM
—
—
—
—
10
200
µA
µA
ON CHARACTERISTICS
Peak Forward On–State Voltage
(1)
(I
TM
= 4 A Peak)
V
TM
— — 2.0 Volts
Gate Trigger Current (Continuous dc)
(2)
(V
AK
= 7 Vdc, R
L
= 100 Ohms)
(T
C
= –40°C)
I
GT
—
—
—
—
200
500
µA
Gate Trigger Voltage (Continuous dc)
(2)
(V
AK
= 7 Vdc, R
L
= 100 Ohms)
V
GT
— — 1.0 Volts
Gate Non-Trigger Voltage
(2)
(V
AK
= 12 Vdc, R
L
= 100 Ohms, T
J
= 110°C)
V
GD
0.2 — — Volts
Holding Current
(V
AK
= 7 Vdc, Initiating Current = 200 mA, Gate Open)
I
H
— — 5.0 mA
DYNAMIC CHARACTERISTICS
Critical Rate–of–Rise of Off–State Voltage
(T
J
= 110°C)
dv/dt — 10 — V/µs
(1) Pulse Test: Pulse Width ≤ 1.0 ms, Duty Cycle ≤ 1%.
(2) R
GK
current is not included in measurement.