2016-04-11 2-Chip Silicon PIN Photodiode Version 1.4 KOM 2125 Features: • Suitable for applications from 400 nm to 1100 nm • Short switching time (typ. 25 ns) Applications • Industrial electronics • For control and drive circuits • Path and angle scanning • Edge control Ordering Information Type: Photocurrent Ordering Code IP [µA] Ev = 1000 lx, Std.
Version 1.4 KOM 2125 Maximum Ratings (TA = 25 °C) Parameter Symbol Values Unit Operating and storage temperature range Top; Tstg -40 ... 80 °C Reverse voltage VR 60 V Total Power dissipation Ptot 150 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2000 V Characteristics (TA = 25 °C) Parameter Symbol Values Unit Photocurrent (Ev = 1000 lx, Std.
Version 1.4 KOM 2125 Parameter Symbol Values Unit Short-circuit current (Ev = 1000 lx, Std. Light A; Diode B) (typ) ISC 95 µA Rise and fall time (VR = 5 V, RL = 50 Ω, λ = 850 nm; Diode A) (typ) tr, tf 0.018 µs Rise and fall time (VR = 5 V, RL = 50 Ω, λ = 850 nm; Diode B) (typ) tr, tf 0.
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Version 1.4 KOM 2125 Capacitance 1) page 10 C = f(VR), f = 1 MHz, E = 0 Dark Current 1) page 10 IR = f(TA), VR = 10 V, E = 0, normalized to TA = 25°C Package Outline 2 A 3 B 1 8.5 (0.335) Cathode 8.2 (0.323) 6.7 (0.264) 6.2 (0.244) Chip position 0...0.1 (0...0.004) 0.3 (0.012) 4.3 (0.169) 5.0 (0.197) 1.4 (0.055) ±0.2 (0.008) 4.5 (0.177) Photosensitive area A = 2 (0.079) x 2 (0.079) B = 5 (0.197) x 2 (0.079) 0.9 (0.035) 0.7 (0.028) 5.2 (0.205) Active area 1.2 (0.047) 1.1 (0.
Version 1.4 KOM 2125 Approximate Weight: 86 mg Reflow Soldering Profile Product complies to MSL Level 4 acc. to JEDEC J-STD-020D.01 OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Taping Dimensions in mm (inch).
Version 1.4 KOM 2125 Tape and Reel 16 mm tape with 1400 pcs. on ∅ 180 mm reel W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Tape dimensions [mm] Tape dim ensions in m m W P0 16 + 0.3 / - 0.1 4 ± 0.1 P1 P2 D0 E F 12 ± 0.1 or 8 ± 0.1 2 ± 0.1 1.5 ± 0.1 1.75 ± 0.1 7.5 ± 0.
Version 1.4 KOM 2125 Dry Packing Process and Materials Moisture-sensitive label or print Barcode label L VE el LE see lab e If nk, bla cod bar y . H) (R . dit mi hu e ve ed ag ati RH % /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe TIO or d , cte itio U g coSEND an bje ing ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < tor ll pro SE _ < urs ). urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ).
Version 1.4 KOM 2125 Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
Version 1.4 KOM 2125 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ.
Version 1.4 KOM 2125 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.
