Datasheet

ManualsBrandsOsram Opto Semiconductors ManualsOptical DetectorsPhotodiode 950 nm 150 mW 2016

SFH 2201

Version 1.1 | 2018-07-23

Produktdatenblatt | Version 1.1

www.osram-os.com

SFH 2201

TOPLED

Silicon PIN Photodiode with Enhanced Blue Sensi-

tivity

Applications

— Electronic Equipment — Industrial Automation (Machine Controls, Light

Barriers, Vision Controls)

Features:

— Package: clear silicone

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— Suitable for re󰘱ow soldering

— small package (WxDxH): 4 mm x 5.1 mm x 0.85mm

— Solder control structure

Ordering Information

Type Photocurrent Photocurrent Ordering Code

typ.

= 1000 lx; white LED; V

= 5 V E

= 1000 lx; white LED; V

= 5 V

SFH 2201 ≥ 10 µA 13 µA Q65112A3981

Summary of content (15 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.1 SFH 2201 SFH 2201 TOPLED ® Silicon PIN Photodiode with Enhanced Blue Sensitivity Applications ——Electronic Equipment ——Industrial Automation (Machine Controls, Light Barriers, Vision Controls) Features: ——Package: clear silicone ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ——Suitable for reflow soldering ——small package (WxDxH): 4 mm x 5.1 mm x 0.
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SFH 2201 Maximum Ratings TA = 25 °C Parameter Symbol Operating Temperature Top min. max. -40 °C 85 °C Storage temperature Tstg min. max. -40 °C 85 °C Reverse voltage VR max. 16 V Total power dissipation Ptot max. 150 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
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SFH 2201 Characteristics TA = 25 °C Parameter Symbol Spectral sensitivity VR = 5 V; Std. Light A, T = 2856 K S typ. 76 nA/lx Wavelength of max sensitivity λS max typ. 950 nm Spectral range of sensitivity λ10% typ. 300 ... 1100 nm Radiant sensitive area A typ. 8.12 mm² Dimensions of active chip area LxW typ. 2.85 x 2.85 mm x mm Half angle φ typ. 60 ° Dark current VR = 10 V IR typ. max. Spectral sensitivity of the chip λ = 400 nm Sλ typ. 0.
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SFH 2201 Relative Spectral Sensitivity 1), 2) Srel = f (λ) [ ] 100 80 60 40 20 400 Directional Characteristics 600 800 1000 λ[ ] 1), 2) Srel = f (φ) 40 50 30 20 10 60 ϕ 0 1.0 0.8 0.6 70 0.4 80 0.2 0 90 1.0 0.8 100 OHF01402 4 Version 1.1 | 2018-07-23 0.6 0.
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SFH 2201 Dark Current 1), 2) IR = f (VR) ; E = 0 [ ] 1200 1000 800 600 0 Capacitance 2 4 6 8 10 12 14 16 [ ] 1), 2) C = f (VR); f = 1 MHz; E = 0; [ ] 70 60 50 40 30 20 10 10-6 10-5 10-4 10-3 0.01 0.1 [ ] 5 Version 1.
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SFH 2201 Dimensional Drawing 3) Approximate Weight: 46.0 mg Package marking: Cathode 6 Version 1.
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SFH 2201 Recommended Solder Pad 3) Handling Indication: The package is casted with silicone. Mechanical stress at the silicone surface of the unit should be avoided. Pickup the device at the plastic frame. Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 7 Version 1.
PAGE 8
SFH 2201 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures r
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SFH 2201 Tape and Reel 4) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 1500 9 Version 1.
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SFH 2201 Barcode-Product-Label (BPL) Dry Packing Process and Materials 3) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < ). urs urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ).
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SFH 2201 Transportation Packing and Materials 3) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Muster
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SFH 2201 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
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SFH 2201 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
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SFH 2201 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ.