Datasheet

ManualsBrandsOsram Opto Semiconductors ManualsOptical DetectorsPhototransistor 990nm 15 mA 35 V SMD

SFH 3600

Version 1.5 | 2018-08-08

Produktdatenblatt | Version 1.1

www.osram-os.com

SFH 3600

MIDLED

Silicon NPN Phototransistor in MIDLED package

Applications

— Gesture Recognition

— Industrial Automation (Machine Controls, Light

Barriers, Vision Controls)

— Remote Control, Proximity, Ambient Light Sens-

ing

Features:

— Package: clear silicone

— Quali󰘰cations: The product quali󰘰cation test plan is based on the guidelines of AEC-Q101-REV-C,

Stress Test Quali󰘰cation for Automotive Grade Discrete Semiconductors.

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— Toplooker

— Narrow half angle (± 20°)

— Spectral range of sensitivity: (typ) 500 ... 1100 nm

— Low pro󰘰le component (1,6 mm)

— Emitter in same package (SFH 46xx) available

Ordering Information

Type Photocurrent Ordering Code

= 5 V;

= 950 nm; E

= 0.1 mW/cm²

PCE

SFH 3600-Z 100 ... 500 µA Q65110A1573

SFH 3600-2/3 100 ... 320 µA Q65110A2665

SFH 3600-3/4-Z 160 ... 500 µA Q65110A2666

Only one bin within one packing unit (variation less than 2:1)

Summary of content (16 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.1 SFH 3600 SFH 3600 MIDLED ® Silicon NPN Phototransistor in MIDLED package Applications ——Gesture Recognition ——Industrial Automation (Machine Controls, Light Barriers, Vision Controls) ——Remote Control, Proximity, Ambient Light Sensing Features: ——Package: clear silicone ——Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors.
PAGE 2
SFH 3600 Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Collector-emitter voltage VCE max. 35 V Collector current IC max. 15 mA Collector surge current τ ≤ 10 µs ICS max. 75 mA Emitter-collector voltage VEC max. 7V Total power dissipation Ptot max. 130 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
PAGE 3
SFH 3600 Characteristics TA = 25 °C Parameter Symbol Wavelength of max sensitivity λS max typ. 990 nm Spectral range of sensitivity λ10% typ. 500 ... 1100 nm Chip dimensions LxW typ. 0.35 x 0.35 mm x mm Radiant sensitive area A typ. 0.04 mm² Half angle φ typ. 20 ° Dark current VCE = 20 V; E = 0 ICE0 typ. max. 1 nA 50 nA Rise time IC = 1 mA; VCC = 5 V; RL = 1 kΩ tr typ. 45 µs Fall time IC = 1 mA; VCC = 5 V; RL = 1 kΩ tf typ.
PAGE 4
SFH 3600 Relative Spectral Sensitivity 3), 4) Srel = f (λ), axial direction OHF02405 100 Srel % 80 70 60 50 40 30 20 10 0 400 500 600 700 800 900 nm 1100 λ Directional Characteristics 3), 4) Srel = f (φ) 40˚ 30˚ 20˚ 10˚ ϕ 50˚ 60˚ 0˚ 1.0 0.8 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 1.0 0.8 100˚ OHF02432 4 Version 1.5 | 2018-08-08 0.6 0.
PAGE 5
SFH 3600 Dark Current 3), 4) ICE0 = f (VCE) ; E = 0 ; IR OHF02420 101 nA 100 10-1 10-2 0 5 10 15 20 25 V 30 VR Collector-Emitter Capacitance CCE = f (VCE); f = 1 MHz; E = 0 ; C CE OHF00592 3.0 pF 2.5 2.0 1.5 1.0 0.5 10-1 10 0 101 0 -2 10 5 Version 1.
PAGE 6
SFH 3600 Dark Current Photocurrent 3) ICE0 = f (TA); VCE = 20 V; E = 0 IPCE,rel = f (TA); VCE = 5 V OHF00380 10 3 nA 3) Ι PCE Ι CEO Ι PCE 25 10 2 OHF01524 1.6 1.4 1.2 1.0 10 1 0.8 0.6 10 0 0.4 0.2 10 -1 0 20 40 60 80 ˚C 100 TA 6 Version 1.
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SFH 3600 Dimensional Drawing 5) Approximate Weight: 23.0 mg Package marking: Emitter Pin 1 collector emitter 2 Description 7 Version 1.
PAGE 8
SFH 3600 Recommended Solder Pad 5) Pad 1: collector The package is casted with silicone. Mechanical stress at the surface of the unit should be avoided. Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 150 tL tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 8 Version 1.
PAGE 9
SFH 3600 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures r
PAGE 10
SFH 3600 Tape and Reel 6) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 2000 10 Version 1.
PAGE 11
SFH 3600 Barcode-Product-Label (BPL) Dry Packing Process and Materials 5) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < ). urs urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ).
PAGE 12
SFH 3600 Transportation Packing and Materials 5) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Muster
PAGE 13
SFH 3600 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
PAGE 14
SFH 3600 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
PAGE 15
SFH 3600 Glossary 1) IPCEmin: IPCEmin is the min. photocurrent of the specified group. 2) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each 3) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures.