Datasheet

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SFH 3710

Version 1.4 | 2018-11-26

Produktdatenblatt | Version 1.1

www.osram-os.com

Applications

SFH 3710

CHIPLED

Silicon NPN Phototransistor with V

Characteristics

— Accent (BAR)

— Area Lights

— Backlighting (Smartphone, Tablet)

— Electronic Equipment

Features:

— Package: clear epoxy

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— Spectral range of sensitivity: (typ) 350 ... 950 nm

— Adapted to human eye sensitivity (V

)

— Very small SMT package

Ordering Information

Type Photocurrent Ordering Code

= 5 V;

= 560 nm; E

= 0.01 mW/cm²

PCE

SFH 3710-Z 2.5 ... 12.5 µA Q65110A3107

SFH 3710-3/4-Z 4.0 ... 12.5 µA Q65110A3511

SFH 3710-2/3-Z 2.5 ... 8.0 µA Q65110A3512

Single bins on request.

Summary of content (16 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.1 SFH 3710 SFH 3710 CHIPLED ® Silicon NPN Phototransistor with Vλ Characteristics Applications ——Accent (BAR) ——Backlighting (Smartphone, Tablet) ——Area Lights ——Electronic Equipment Features: ——Package: clear epoxy ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ——Spectral range of sensitivity: (typ) 350 ...
PAGE 2
SFH 3710 Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 85 °C Storage temperature Tstg min. max. -40 °C 85 °C Collector-emitter voltage VCE max. 5.5 V Collector current IC max. 20 mA Emitter-collector voltage VEC max. 0.5 V ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
PAGE 3
SFH 3710 Characteristics TA = 25 °C Parameter Symbol Wavelength of max sensitivity λS max typ. 570 nm Spectral range of sensitivity λ10% typ. 350 ... 950 nm Dimensions of chip area LxW typ. 0.75 x 0.75 mm x mm Radiant sensitive area A typ. 0.29 mm² Half angle φ typ. 60 ° Photocurrent VCE = 5 V; Std. Light A; Ev = 1000 lx IPCE typ. 350 µA Dark current VCE = 5 V; E = 0 ICE0 typ. max. 3 nA 50 nA Collector-emitter saturation voltage 1) IC = IPCE,min X 0.3; Ee = 0.
PAGE 4
SFH 3710 Grouping TA = 25 °C Group Photocurrent VCE = 5 V; λ = 560 nm; Ee = 0.01 mW/cm² min. IPCE Photocurrent VCE = 5 V; λ = 560 nm; Ee = 0.01 mW/cm² max. IPCE 2 2.5 µA 5.0 µA 3 4.0 µA 8.0 µA 4 6.3 µA 12.5 µA Relative Spectral Sensitivity 2), 3) Srel = f (λ) 100 OHF04047 Srel % 80 70 60 50 40 30 20 10 0 400 500 600 700 800 900 nm 1100 λ 4 Version 1.
PAGE 5
SFH 3710 Directional Characteristics 2), 3) Srel = f (φ) 40 30 20 10 ϕ 0 OHF01402 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 Photocurrent 1.0 0.8 0.6 0 20 40 Photocurrent 2), 3) IPCE = f (Ev); 60 80 100 120 2), 3) IPCE = f (Ev); OHF04055 10 2 mA OHF04056 100 % I PCE rel I PCE 10 0.4 1 10 0 80 70 60 10 -1 50 40 10 -2 30 20 10 -3 10 10 -4 10 0 10 1 10 2 10 3 10 4 lx 10 5 EV 5 Version 1.
PAGE 6
SFH 3710 Collector-Emitter Capacitance CCE = f (VCE); f = 1 MHz; E = 0 ; C CE OHF04052 4.0 pF 3.0 2.5 2.0 1.5 1.0 0.5 0 -3 10 10 -2 10 -1 10 0 10 1 V 10 2 VCE 6 Version 1.
PAGE 7
SFH 3710 4) 0.95 (0.037) 0.65 (0.026) 0.4 (0.016) 0.2 (0.008) Dimensional Drawing 0.5 (0.020) 0.3 (0.012) 2.1 (0.083) 1.9 (0.075) 1.5 (0.059) 1.3 (0.051) 1.35 (0.053) 1.15 (0.045) Collector mark Approximate Weight: 3.8 mg Package marking: Collector 7 Version 1.4 | 2018-11-26 1.0 (0.039) 0.8 (0.
PAGE 8
SFH 3710 Recommended Solder Pad 4) 1.25 3.2 1 Bauteil positioniert Component location on pad OHFP2578 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 8 Version 1.
PAGE 9
SFH 3710 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures r
PAGE 10
SFH 3710 Tape and Reel 5) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A 180 mm W Nmin 8 + 0.3 / - 0.1 10 Version 1.4 | 2018-11-26 W1 60 W2 max 8.4 + 2 14.
PAGE 11
SFH 3710 Barcode-Product-Label (BPL) Dry Packing Process and Materials 4) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv ˚C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co ˚C 72 si nd H ou 5 te 48 ˚C su es e H co ± 24 6 da e y 40 be oc tim ˚C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le ˚C at lo at or e.
PAGE 12
SFH 3710 Transportation Packing and Materials 4) Barcode label N O : (Q )Q TY :2 00 0 (9 D ) D /C :0 (X ) Packing Sealing label Length 200 ± 5 mm 195 ± 5 mm 12 Version 1.
PAGE 13
SFH 3710 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
PAGE 14
SFH 3710 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you.
PAGE 15
SFH 3710 Glossary 1) IPCEmin: IPCEmin is the min. photocurrent of the specified group. 2) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.