SFH 3710
8
Version 1.4 | 2018-11-26
Recommended Solder Pad
4)
1.25
1
Component location on pad
Bauteil positioniert
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0
s
50
100
150
200
250
300
50 100 150 200 250 300
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
