www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4059S SFH 4059S CHIPLED ® Lens High Power Infrared Emitter (850 nm) Applications ——Industrial Automation (Machine controls, Light barriers, Vision controls) Features: ——Package: black epoxy ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ——High optical power ——Double stack emitter ——Very small package: (LxWxH) 3.2 mm x 1.6 mm x 1.
SFH 4059S Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 85 °C Storage temperature Tstg min. max. -40 °C 85 °C Reverse voltage 2) VR max. 12 V Forward current IF max. 50 mA Surge current tp ≤ 300 µs; D = 0 IFSM max. 0.7 A Power consumption Ptot max. 175 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
SFH 4059S Characteristics IF = 50 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 860 nm Centroid wavelength λcentroid typ. 850 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 30 nm Half angle φ typ. 15 ° Dimensions of active chip area LxW typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) IF = 50 mA; RL = 50 Ω tr typ. 15 ns Fall time (10% / 90%) IF = 50 mA; RL = 50 Ω tf typ. 15 ns Forward voltage VF typ. max. 2.95 V 3.
SFH 4059S Brightness Groups TA = 25 °C Group Irradiance 1) IF = 50 mA; tp = 20 ms min. Ee Irradiance 1) IF = 50 mA; tp = 20 ms max. Ee Q 6.3 mW/cm² 12.5 mW/cm² R 10.0 mW/cm² 20.0 mW/cm² S 16.0 mW/cm² 32.0 mW/cm² Only one group in one packing unit (variation lower 2:1). Ee measured in the near field with a detector (7.2 mm diameter) in 20 mm distance (Ω = 0.
SFH 4059S Radiation Characteristics Irel = f (φ) 40˚ 6), 7) 30˚ 20˚ 10˚ ϕ 0˚ OHF04536 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 Forward current 0.8 0.6 0.4 20˚ 40˚ Irradiance 6), 7) IF = f (VF); single pulse; tp = 100 µs IF 0˚ 80˚ 100˚ 120˚ 6), 7) Ee/Ee(50mA) = f (IF); single pulse ; tp = 25 µs OHF05562 103 mA 60˚ OHF05592 102 Εe Ε e (50 mA) 102 100 10-1 101 10-2 100 2 3 4 V VF 5 Version 1.
SFH 4059S Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 420 K / W IF = f (tp); duty cycle D = parameter; TA = 25°C OHF05588 55 I F mA IF 45 40 35 30 25 20 15 10 5 0 0 20 40 60 80 ˚C 100 TA Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85°C 0.75 A IF 0.75 A OHF05590 t D = TP tP IF T 0.60 0.55 0.50 0.45 D= 0.40 0.005 0.35 0.01 0.02 0.30 0.05 0.25 0.1 0.2 0.20 0.5 0.15 1 0.10 0.
SFH 4059S Dimensional Drawing 8) Approximate Weight: 8.0 mg Package marking: Anode Pin 1 Cathode Anode 2 Description 7 Version 1.
SFH 4059S Recommended Solder Pad 8) Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 150 tL tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 8 Version 1.
SFH 4059S Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures
SFH 4059S Tape and Reel 9) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 2000 10 Version 1.
SFH 4059S Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < ). urs urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ).
SFH 4059S Transportation Packing and Materials 8) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Muster
SFH 4059S Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
SFH 4059S Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
SFH 4059S Glossary 1) Irradiance: Measured at a solid angle of Ω = 0.1 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each 5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
SFH 4059S Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 16 Version 1.
