www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4140 SFH 4140 MIDLED ® T- MIDLED High Power Infrared Emitter (940 nm) Applications ——Flash & Autofocus Features: ——Package: clear silicone ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ——High Power Infrared LED (55 mW) ——Half angle: ± 25° ——Low profile component ——Sidelooker ——to be recessed into PCB Ordering Information Type Radiant intensity 1) IF = 100 mA; tp = 20 ms Ie 25 ... 80 mW/sr SFH 4140 1 Version 1.
SFH 4140 Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Reverse voltage 2) VR max. 12 V Forward current IF max. 100 mA Surge current tp ≤ 300 µs; D = 0 IFSM max. 1A Power consumption Ptot max. 180 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
SFH 4140 Characteristics IF = 100 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 950 nm Centroid wavelength λcentroid typ. 940 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 42 nm Half angle φ typ. 25 ° Dimensions of active chip area LxW typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) RL = 50 Ω tf typ. 12 ns Forward voltage VF typ. max. 1.5 V 1.8 V Forward voltage IF = 1 A; tp = 100 µs VF typ. max. 2.
SFH 4140 Brightness Groups TA = 25 °C Group Radiant intensity IF = 100 mA; tp = 20 ms min. Ie Radiant intensity IF = 100 mA; tp = 20 ms max. Ie T 25 mW/sr 50 mW/sr U 40 mW/sr 80 mW/sr Only one group in one packing unit (variation lower 2:1) Relative Spectral Emission 6), 7) Irel = f (λ); IF = 100 mA; tp = 20 ms OHF04134 100 I rel % 80 60 40 20 0 800 850 900 950 nm 1025 λ 4 Version 1.
SFH 4140 Radiation Characteristics Irel = f (φ) 40˚ 6), 7) 30˚ 20˚ 10˚ ϕ 0˚ OHF05640 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 Forward current 0.8 0.6 0˚ 20˚ 60˚ 80˚ 100˚ 120˚ 6), 7) Ie/Ie(100mA) = f (IF); single pulse; tp = 25 µs OHF03822 100 A OHF03821 101 Ie I e (100 mA) 10-1 5 100 5 10-2 10-1 5 5 10-3 10-2 5 5 10-4 40˚ Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 µs IF 0.4 0 0.5 1 1.5 2 V 2.5 VF 5 Version 1.
SFH 4140 Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 450 K / W IF = f (tp); duty cycle D = parameter; TA = 25°C IF OHF05637 110 mA IF 90 0.9 80 0.8 70 0.7 60 0.6 50 0.5 40 0.4 30 0.3 20 0.2 10 0.1 0 0 20 40 60 80 ˚C 110 TA Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85°C IF 1.1 A 1.1 A OHF05639 t D = TP 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 tP IF T D= 0.005 0.01 0.02 0.
SFH 4140 Dimensional Drawing 8) Approximate Weight: 10.0 mg Package marking: Cathode 7 Version 1.
SFH 4140 Recommended Solder Pad 8) The package is casted with silicone. Mechanical stress at the surface of the unit should be avoided. Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 150 tL tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 8 Version 1.
SFH 4140 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures r
SFH 4140 Tape and Reel 9) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 2000 10 Version 1.
SFH 4140 Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < ). urs urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ).
SFH 4140 Transportation Packing and Materials 8) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Muster
SFH 4140 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
SFH 4140 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
SFH 4140 Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each 5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
SFH 4140 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 16 Version 1.
