Datasheet

ManualsBrandsOsram Opto Semiconductors ManualsIR EmittersIR Emitter 950nm 70mA 1.6V PLCC2

SFH 4244

Version 1.5 | 2018-09-18

Produktdatenblatt | Version 1.1

www.osram-os.com

SFH 4244

SIDELED

High Power Infrared Emitter (940 nm)

Applications

— Electronic Equipment

— Industrial Automation (Machine Controls, Light

Barriers, Vision Controls)

— Measurement Levelling

Features:

— Package: clear epoxy

— Quali󰘰cations: The product quali󰘰cation test plan is based on the guidelines of AEC-Q101-REV-C,

Stress Test Quali󰘰cation for Automotive Grade Discrete Semiconductors.

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— High Power Infrared LED

— Short switching times

Ordering Information

Type Radiant intensity

Radiant intensity

Ordering Code

typ.

= 70 mA; t

= 20 ms I

= 70 mA; t

= 20 ms

SFH 4244-Z 4.0 ... 20.0 mW/sr 11 mW/sr Q65110A7516

SFH 4244-QR-Z 6.3 ... 20.0 mW/sr 11 mW/sr Q65110A8753

Summary of content (16 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4244 SFH 4244 SIDELED ® High Power Infrared Emitter (940 nm) Applications ——Measurement Levelling ——Electronic Equipment ——Industrial Automation (Machine Controls, Light Barriers, Vision Controls) Features: ——Package: clear epoxy ——Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ——ESD: 2 kV acc.
PAGE 2
SFH 4244 Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Forward current IF max. 70 mA Surge current tp ≤ 100 µs; D = 0 IFSM max. 0.7 A Reverse voltage 2) VR max. 12 V Power consumption Ptot max. 140 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
PAGE 3
SFH 4244 Characteristics IF = 70 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 950 nm Centroid wavelength λcentroid typ. 940 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 42 nm Half angle φ typ. 60 ° Dimensions of active chip area LxW typ. 0.2 x 0.2 mm x mm Rise time (10% / 90%) RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) RL = 50 Ω tf typ. 12 ns Forward voltage VF typ. max. 1.6 V 2V Forward voltage IF = 500 mA; tp = 100 µs VF typ. max. 2.
PAGE 4
SFH 4244 Brightness Groups TA = 25 °C Group Radiant intensity IF = 70 mA; tp = 20 ms min. Ie Radiant intensity IF = 70 mA; tp = 20 ms max. Ie P1 4.0 mW/sr 6.3 mW/sr P2 5.0 mW/sr 8.0 mW/sr Q1 6.3 mW/sr 10.0 mW/sr Q2 8.0 mW/sr 12.5 mW/sr R1 10.0 mW/sr 16.0 mW/sr R2 12.5 mW/sr 20.0 mW/sr Only one group in one packing unit (variation lower 2:1).
PAGE 5
SFH 4244 Radiation Characteristics 6), 7) Irel = f (φ) 40˚ 30˚ 20˚ 10˚ 0˚ ϕ 50˚ OHL01660 1.0 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 0 90˚ 100˚ 1.0 0.8 Forward current 0.6 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ Relative Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 µs IF 0.4 Ee/Ee(70mA) = f (IF); single pulse ; tp = 25 µs OHF03828 100 A 6), 7) OHF03827 101 Ie I e (70 mA) 10-1 5 100 5 10-2 5 10-1 10-3 5 5 10-4 0 0.5 1 1.5 2 2.5 V 3 VF 5 Version 1.
PAGE 6
SFH 4244 Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 500 K / W IF = f (tp); duty cycle D = parameter; TA = 25°C IF OHF03732 80 mA IF 70 60 0.7 A 0.6 0.5 50 0.4 40 0.3 30 0.2 20 0 20 40 80 60 100 ˚C 120 Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85°C IF 0.6 OHF03824 t tP D = TP 0.5 0.4 0.3 0.2 0.1 IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 IF T D= 0.005 0.01 0.02 0.05 0.
PAGE 7
SFH 4244 Dimensional Drawing 8) 1.1 (0.043) (1.4 (0.055)) (R1) 4.2 (0.165) 3.8 (0.150) Approximate Weight: 76.0 mg Package marking: Cathode 7 Version 1.5 | 2018-09-18 Anode 3.8 (0.150) 3.4 (0.134) (2.9 (0.114)) Cathode marking 2.54 (0.100) spacing (2.85 (0.112)) 0.9 (0.035) (0.3 (0.012)) Cathode 0.7 (0.028) 4.2 (0.165) 3.8 (0.150) 2.4 (0.094) 2.8 (0.110) (2.4 (0.
PAGE 8
SFH 4244 Recommended Solder Pad 8) Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 150 tL tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 8 Version 1.
PAGE 9
SFH 4244 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP Maximum 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 250 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 4 10 Ramp-down rate* TP to 100 °C °C 480 Time 25 °C to TP All temperatu
PAGE 10
SFH 4244 Tape and Reel 9) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 330 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 2000 10 Version 1.
PAGE 11
SFH 4244 Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < ). urs urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ).
PAGE 12
SFH 4244 Transportation Packing and Materials 8) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Muster
PAGE 13
SFH 4244 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
PAGE 14
SFH 4244 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
PAGE 15
SFH 4244 Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.