Datasheet

2012-12-05 12
Version 1.0 LS P47F
Recommended Solder Pad
9) page 20
reflow soldering
Empfohlenes Lötpaddesign
9) Seite 20
Reflow-Löten
Recommended Solder Pad
9) page 20
reflow soldering
Empfohlenes Lötpaddesign
9) Seite 20
Reflow-Löten
Notes: The lower solder pad layout represents the
recommended solder pad for top mounting.
OHAY1307
Hole in PCB
Solder resist
Lötstoplack
(ø2.1 (0.083)
2.6 (0.102)
3.6 (0.142)
(0.5 (0.020))
0.7 (0.028)
0.025 (0.001)
+0.1 (0.004)
Padgeometrie für verbesserte Wärmeableitung
Paddesign for improved heat dissipation
Bauteil positioniert, Rückseite
Component location on pad, backside
)
OHAY2629
Lötstoplack
Solder resist
ø2.3 (0.091)
2.6 (0.102)
0.2 (0.008)
0.7 (0.028)
0.8 (0.031)
No solder resist; no copper pad
Kein Lötstoplack; kein Kupfer