Datasheet

Version 1.0 LY P47K
2013-10-17 11
Recommended Solder Pad
9) page 19
Reflow soldering
Empfohlenes Lötpaddesign
9) Seite 19
Reflow-Löten
Recommended Solder Pad
9) page 19
Reflow soldering
Empfohlenes Lötpaddesign
9) Seite 19
Reflow-Löten
Note: The lower solder pad layout represents the
recommended solder pad for top mounting.
OHAY1307
Hole in PCB
Solder resist
Lötstoplack
(ø2.1 (0.083)
2.6 (0.102)
3.6 (0.142)
(0.5 (0.020))
0.7 (0.028)
0.025 (0.001)
+0.1 (0.004)
Padgeometrie für verbesserte Wärmeableitung
Paddesign for improved heat dissipation
Bauteil positioniert, Rückseite
Component location on pad, backside
)
OHAY2629
Lötstoplack
Solder resist
ø2.3 (0.091)
2.6 (0.102)
0.2 (0.008)
0.7 (0.028)
0.8 (0.031)
No solder resist; no copper pad
Kein Lötstoplack; kein Kupfer