Datasheet

Version 1.0 (Replacement in due course) LS T776
2013-06-28 11
Recommended Solder Pad
9) page 18
Reflow soldering
Empfohlenes Lötpaddesign
9) Seite 18
Reflow-Löten
OHLPY977
1.2 (0.047)
6 (0.236)
2.6 (0.102)
heat dissipation
Cu-area > 16 mm
Cu-Fläche > 16 mm
2
for improved
Wärmeableitung
für verbesserte
Padgeometrie
Paddesign
2
Solder resist
Lötstopplack
6 (0.236)
1.2 (0.047)
2.6 (0.102)
Hole on PCB
2.8 (0.110)
2.4 (0.094)