Datasheet

2012-04-20 12
LSY T676
Empfohlenes Lötpaddesign
8) Seite 17
IR Reflow Löten
Recommended Solder Pad
8) page 17
IR Reflow Soldering
Empfohlenes Lötpaddesign
8) Seite 17
Wellenlöten (TTW)
Recommended Solder Pad
8) page 17
TTW Soldering
OHLPY439
Padgeometrie für
verbesserte Wärmeableitung
improved heat dissipation
Paddesign for
Lötstoplack
Solder resist
1.1 (0.043)
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
3.3 (0.130)
0.5 (0.020)
7.5 (0.295)
0.4 (0.016)
Cathode marking
Kathoden Markierung / Cu Fläche / 12 mm per pad
2
Cu-area
_
<
3.3 (0.130)
OHAY0583
6.1 (0.240)
2.8 (0.110)
2 (0.079)
3 (0.118)
6 (0.236)
3.5 (0.138)
1.5 (0.059)
2 (0.079)
3.5 (0.138)1 (0.039)
8 (0.315)
2.8 (0.110)
0.5 (0.020)
7.5 (0.295)
Solder resist
Lötstoplack
PCB-direction Bewegungsrichtung der Platine
2 (0.079)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for
2
Cu Fläche / > 12 mm per pad
Cu-area