Datasheet

ManualsBrandsOSRAM ManualsPhotodiodes & PhototransistorsPhotodiode 1100 nm 60 °

2013-07-03 1

201 3- 07- 0 3

Silicon PIN Photodiode

Silizium-PIN-Fotodiode

Version 1.1

SFH 2400

Ordering Information

Bestellinformation

Features: Besondere Merkmale:

• Especially suitable for applications from 380 nm to

1100 nm

• Speziell geeignet für Anwendungen im Bereich von

380 nm bis 1100 nm

• Short switching time (typ. 5 ns) • Kurze Schaltzeit (typ. 5 ns)

Applications Anwendungen

• Photointerrupters • Lichtschranken

• Industrial electronics • Industrieelektronik

• For control and drive circuits • Messen / Steuern / Regeln

Type: Photocurrent Ordering Code

Typ: Fotostrom Bestellnummer

= 5 V, standard light A, E

= 1000lx

[µA]

SFH 2400 10 (≥ 6) Q65110A2628

Summary of content (10 pages)

PAGE 1
2013-07-03 Silicon PIN Photodiode Silizium-PIN-Fotodiode Version 1.1 SFH 2400 Features: Besondere Merkmale: • Especially suitable for applications from 380 nm to 1100 nm • Short switching time (typ. 5 ns) • Speziell geeignet für Anwendungen im Bereich von 380 nm bis 1100 nm • Kurze Schaltzeit (typ.
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Version 1.1 SFH 2400 Maximum Ratings (TA = 25 °C) Grenzwerte Parameter Symbol Values Unit Bezeichnung Symbol Werte Einheit Operating and storage temperature range Betriebs- und Lagertemperatur Top; Tstg -40 ...
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Version 1.1 SFH 2400 Parameter Symbol Values Unit Bezeichnung Symbol Werte Einheit Spectral sensitivity of the chip Spektrale Fotoempfindlichkeit des Chips (λ = 870 nm) Sλ typ 0.65 A/W Quantum yield of the chip Quantenausbeute des Chips η 0.93 Electro ns /Photon Open-circuit voltage Leerlaufspannung (Ev = 1000 lx, Std. Light A) VO 320 mV Short-circuit current Kurzschlussstrom (Ev = 1000 lx, Std.
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Version 1.
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Version 1.1 SFH 2400 Dark Current Dunkelstrom IR = f(TA), VR = 10 V, E = 0 Package Outline Maßzeichnung Dimensions in mm (inch). / Maße in mm (inch).
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Version 1.1 SFH 2400 Pinning Anschlussbelegung Pin Description Anschluss Beschreibung 1 cathode / Kathode 2 n.c. 3 anode / Anode Package Smart DIL Gehäuse Smart DIL Method of Taping Gurtung Dimensions in mm (inch). / Maße in mm (inch).
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Version 1.1 SFH 2400 0.3 1.3 1 Recommended Solder Pad Empfohlenes Lötpaddesign 1.8 2.4 Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation 1.8 OHF02393 Dimensions in mm. / Maße in mm. Reflow Soldering Profile Reflow-Lötprofil Preconditioning: JEDEC Level 4 acc. to JEDEC J-STD-020D.
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Version 1.
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Version 1.1 SFH 2400 Disclaimer Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you.