Datasheet

Version 1.0 SFH 2500 FA, SFH 2505 FA
2011-10-20 11
Recommended Solder Pad
Empfohlenes Lötpaddesign
SFH 2505 FA
Dimensions in mm (inch). / Maße in mm (inch).
OHF02450
5.9 (0.232)
1.3 (0.051)
2.54 (0.100)
7 (0.276)
3 (0.118)
Cu-Fläche > 20 mm
Cu-area > 20 mm
2
Paddesign for
verbesserte Wärmeableitung
improved heat dissipation
Padgeometrie für
Lötstopplack
Solder resist
Component Location on Pad
Bauteil positioniert
Aussparung 4.85 (0.191)
5.2 (0.205)
Lötpad
(1 (0.039))
1.5 (0.059)
2
±0.05 (0.002)