Datasheet

SFH 4253
2012-03-08 7
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Maße in mm (inch) / Dimensions in mm (inch).
OHLPY970
4.5 (0.177)
2.6 (0.102)
1.5 (0.059)
Cu-area > 16 mm
Cu-Fläche > 16 mm
2
2
Solder resist
Lötstopplack
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for