User Manual

CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
4.8
SUBJECT
CLASS 1 or 2 BLUETOOTH MODULE
PAGE
34 of 60
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter Ordering Information
DATE
23.09.2015
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
18.2 RECOMMENDED FOOT PATTERN PAN132X WITH ANTENNA
Dimensions in mm.
The land pattern dimensions above are meant to serve only as a guide.
For the solder paste screen, use as a first guideline the same foot print as shown
in the Figure above. Solder paste screen cutouts (with slightly different
dimensions) might be optimum depending on your soldering process. For
example, the solder paste screen thickness chosen might have an effect. The
solder screen thickness depends on your production standard 120μm to 150μm
is recommended.
IMPORTANT: In cases where a track or through hole via has to be located under
the module, it must be kept away from PAN132X bottom pads. The PAN132X
multilayer pcb contains an inner RF shielding plane, therefore no pcb shielding
plane below the module is needed.
If you have any questions on these points, contact your local Panasonic
representative.
Schematics and layouts may be sent to [e-mail] for final
review.
17 15 13
14
11
9
8
6
53
2
21
22 10
4
16
Pad = 28 x 0.60mm x 0.60mm
Top View
9.00
0,55
1.80
9.50
0,60
20
23
1
24
19
18
12
7
A
C
B
D