Product Specs
Table Of Contents
- 1 About This Document
- 2 Overview
- 3 Detailed Description
- 4 Specification
- 5 Cautions
- 6 Regulatory and Certification Information
- 6.1 Regulatory and Certification Information BLE
- 6.2 RoHS and REACH Declaration
- 7 Appendix
PAN1770 Bluetooth Module 4 Specification
Product Specification Rev. 1.0 Page 25 of 41
4.9 Recommended Soldering Profile
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Reflow permissible cycles: 2
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Opposite side reflow is prohibited due to module weight
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More than 75 percent of the soldering area shall be coated by solder
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The soldering profiles should be adhered to in order to prevent electrical or
mechanical damage
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Soldering profile assumes lead-free soldering