User Manual
Table Of Contents
- 1. KEY FEATURES
- 2. APPLICATIONS FOR THE MODULE
- 3. DESCRIPTION FOR THE MODULE
- 4. SCOPE OF THIS DOCUMENT
- 5. HISTORY FOR THIS DOCUMENT
- 6. TERMINAL LAYOUT
- 7. BLOCK DIAGRAM
- 8. KEY PARTS LIST
- 9. TEST CONDITIONS
- 10. ABSOLUTE MAXIMUM RATINGS
- 11. OPERATING CONDITIONS
- 12. DC ELECTRICAL CHARACERISTICS
- 13. A/D CONVERTER CHARACTERISTICS
- 14. AC ELECTRICAL CHARACTERISTICS
- 15. SOLDERING TEMPERATURE - TIME PROFILE (FOR REFLOW SOLDERING)
- 16. MODULE DIMENSIONS
- 17. FOOTPRINT OF THE MODULE
- 18. LASER MARKING
- 19. MECHANICAL REQUIREMENTS
- 20. RECOMMENDED LAND PATTERN
- 21. RELIABILITY TESTS
- 22. CAUTIONS
- 23. PACKAGING
- 24. ORDERING INFORMATION
- 25. ROHS DECLARATION
- 26. DATA SHEET STATUS
- 27. REGULATORY INFORMATION
- 28. INDUSTRY CANADA CERTIFICATION
- 29. EUROPEAN R&TTE DECLARATION OF CONFORMITY
- 30. RELATED DOCUMENTS
- 31. GENERAL INFORMATION
- 32. LIFE SUPPORT POLICY
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-PAN2580-102
REV.
1.0
SUBJECT 802.15.4-MODEM PAGE 6 of 31
CUSTOMER’S CODE
PAN2580
PANASONIC’S CODE
ENW59625xxxF
DATE 07.09.2011
PANASONIC ELECTRONIC DEVICES EUROPE GMBH www.pedeu.panasonic.de
6. TERMINAL LAYOUT
Pin
No.
Pin
Name
Pin
Type
Description
A1 GND G DC Power supply, 0V
A2 VCC P DC Power supply, typical 3V (2.7 ~ 3.6V)
A3 VCC P DC Power supply, typical 3V (2.7 ~ 3.6V)
A4 P2.2
D I/O or
A In
GPIO_1, ADC18, I2C SCL
A5 P2.3
D I/O or
A In
GPIO_2, ADC19
A6 P1.6 -
Not Available, Do Not Connect (used for access to the
onboard external memory)
A7 P1.7 -
Not Available, Do Not Connect (used for access to the
onboard external memory)
A8 GND G DC Power supply, 0V
B1~B3 NC - -
B4 P2.1
D I/O or
A In
GPIO_0, ADC17, I2C SDA