User Manual

CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
REV.
1.1
SUBJECT
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE
PAGE
34 of 43
CUSTOMER’S CODE
PAN9320 / PAN9310
PANASONIC’S CODE
ENW49A01x3EF & ENW49A02x3EF
DATE
14.03.2016
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
26.2. INSTALLATION NOTES
(1) Reflow soldering is possible twice based on the conditions in chapter 15.
Set up the temperature at the soldering portion of this product according to this reflow
profile.
(2) Carefully position the products so that their heat will not burn into printed circuit boards or
affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due to the
effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between the cover and
these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) To repair the board by hand soldering, follow the conditions set forth in this chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause damage to
the unit.
(10) For more details on LGA (Land Grid Array) soldering processes refer to the application
note
[7]
.
26.3. USAGE CONDITIONS NOTES
(1) Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, check and evaluate their operation befor assembly on the final products.
(2) Do not use dropped products.
(3) Do not touch, damage or soil the pins.
(4) Follow the recommended condition ratings about the power supply applied to this product.
(5) Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB.
(6) Pressing on parts of the metal cover or fastening objects to the metal cover will cause
damage.
(7) These products are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information and communication
equipment.
26.4. STORAGE NOTES
(1) The module should not be stressed mechanically during storage.
(2) Do not store these products in the following conditions or the performance characteristics
of the product, such as RF performance will be adversely affected:
 Storage in salty air or in an environment with a high concentration of corrosive gas, such as
Cl2, H2S, NH3, SO2, or NOX
 Storage in direct sunlight
 Storage in an environment where the temperature may be outside the range of 5°C to 35°C
range, or where the humidity may be outside the 45 to 85% range.
 Storage of the products for more than one year after the date of delivery Storage period:
Please check the adhesive strength of the embossed tape and soldering after 6 months of
storage.
(3) Keep this product away from water, poisonous gas and corrosive gas.
(4) This product should not be stressed or shocked when transported.
(5) Follow the specification when stacking packed crates (max. 10).