User Manual
Table Of Contents
- 1 General Device Overview
- 2 Basic Operating Information
- 3 PAN1322-SPP Interfaces
- 4 General Device Capabilities
- 5 Ordering Information
- 6 Bluetooth Capabilities
- 7 Electrical Characteristics
- 8 Package Information
- 9 Bluetooth Qualification and Regulatory Certification
- 9.1 Reference Design
- 9.2 FCC Class B Digital Devices Regulatory Notice
- 9.3 FCC Wireless Notice
- 9.4 FCC Interference Statement
- 9.5 FCC Identifier
- 9.6 European R&TTE Declaration of Conformity
- 9.7 Bluetooth Qualified Design ID
- 9.8 Industry Canada Certification
- 9.9 Label Design of the Host Product
- 9.10 Regulatory Test House
- 10 Assembly Guidelines
- 11 Terminology
- 12 References
User’s Manual 45 Revision 1.3, 2013-08-14
Hardware Description
PAN1322-SPP
ENW89841A3KF
Assembly Guidelines
Stencil thickness
A thick solder paste stencil means more surface area to the air and thereby easier for the outgassing flux to leave
the solder.
Temperature soldering profile
Too short preheat time means that the flux does not get enough time to react and flux get entrapped in the solder
and create voids.
Too long reflow time gives larger voids
Too short reflow time gives a fraction of voids