User's Manual
Table Of Contents
- KEY FEATURES
- APPLICATIONS FOR THE MODULE
- DESCRIPTION OF THE MODULE
- SCOPE OF THIS DOCUMENT
- HISTORY FOR THIS DOCUMENT
- TERMINAL LAYOUT
- BLOCK DIAGRAM
- KEY PARTS LIST
- TEST CONDITIONS
- ABSOLUTE MAXIMUM RATINGS
- OPERATING CONDITIONS
- DC ELECTRICAL CHARACTERISTICS
- A/D CONVERTER CHARACTERISTICS
- AC ELECTRICAL CHARACTERISTICS
- MECHANICAL REQUIREMENTS
- SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
- MODULE DIMENSIONS
- FOOT PRINT OF THE MODULE
- LABELING DRAWING
- RECOMMENDED LAND PATTERN
- SOFTWARE
- RELIABILITY TESTS
- APPLICATION NOTES
- PACKAGING
- ORDERING INFORMATION
- ROHS DECLARATION
- DATA SHEET STATUS
- REGULATORY INFORMATION
- RELATED DOCUMENTS
- GENERAL INFORMATION
- LIFE SUPPORT POLICY
CLASSIFICATION
Einstufung
PRODUCT SPECIFICATION
Produktspezifikation
No.
DS-ETR2-2400-102
REV.
D
SUBJECT
Thema
MODEM FOR IEEE802.15.4 (ZIGBEE)
“ZigBee” Modem“ (IEEE802.15.4)
PAGE
Seite
15 of 29
CUSTOMER’S CODE
ETRX2
PANASONIC’S CODE
ENWC9A0xyzE
DATE
Datum
01.08.2006
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
No Limit
Unit
Power On Reset (POR) Specifications
Min Typ Max
31 V
BAT
POR release 1.0 1.2 1.4 Vdc
32 V
BAT
POR assert 0.5 0.6 0.7 Vdc
33 V
CORE
POR release 1.35 1.5 1.65 Vdc
34 V
CORE
POR hysteresis 0.08 0.1 0.12 Vdc
15. MECHANICAL REQUIREMENTS
Mechanische Anforderungen
No.
Item
Punkt
Limit
Grenzwerte
Condition
Bedingung
1
Solderability
Lötfähigkeit
More than 75% of the soldering area shall be
coated by solder
Mehr als 75% der Lötfläche soll mit Lötpaste
bedeckt sein.
Reflow soldering with
recommendable temperature
profile
2
Resistance to
soldering heat
It shall be satisfied electrical requirements and
not be mechanical damage
See chapter 16.2