User's Manual
Table Of Contents
- KEY FEATURES
- APPLICATIONS FOR THE MODULE
- DESCRIPTION OF THE MODULE
- SCOPE OF THIS DOCUMENT
- HISTORY FOR THIS DOCUMENT
- TERMINAL LAYOUT
- BLOCK DIAGRAM
- KEY PARTS LIST
- TEST CONDITIONS
- ABSOLUTE MAXIMUM RATINGS
- OPERATING CONDITIONS
- DC ELECTRICAL CHARACTERISTICS
- A/D CONVERTER CHARACTERISTICS
- AC ELECTRICAL CHARACTERISTICS
- MECHANICAL REQUIREMENTS
- SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
- MODULE DIMENSIONS
- FOOT PRINT OF THE MODULE
- LABELING DRAWING
- RECOMMENDED LAND PATTERN
- SOFTWARE
- RELIABILITY TESTS
- APPLICATION NOTES
- PACKAGING
- ORDERING INFORMATION
- ROHS DECLARATION
- DATA SHEET STATUS
- REGULATORY INFORMATION
- RELATED DOCUMENTS
- GENERAL INFORMATION
- LIFE SUPPORT POLICY
CLASSIFICATION
Einstufung
PRODUCT SPECIFICATION
Produktspezifikation
No.
DS-ETR2-2400-102
REV.
D
SUBJECT
Thema
MODEM FOR IEEE802.15.4 (ZIGBEE)
“ZigBee” Modem“ (IEEE802.15.4)
PAGE
Seite
16 of 29
CUSTOMER’S CODE
ETRX2
PANASONIC’S CODE
ENWC9A0xyzE
DATE
Datum
01.08.2006
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
16. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
Temperatur-Zeit Profil für die Reflowlötung
16.1. FOR LEAD SOLDER
Recommended temp. profile
for reflow soldering
Tem
p
.
[
°C
]
Time [s]
235°C max.
220
±
5°C
200°C
150
±
10°C
90
±
30s
10
±
1s
30 +20/-10s
16.2. FOR LEAD FREE SOLDER
Our used temp. profile
for reflow soldering
Temp.[°C]
Time [s]
230°C -250°C max.
220°C
150°C – 190°C
90
±
30s
30 +20/-10s
Reflow permissible cycle: 2
Opposite side reflow is prohibited due to module weight.