User's Manual

CLASSIFICATION
Einstufung
PRODUCT SPECIFICATION
Produktspezifikation
No.
DS-ETR2-2400-102
REV.
D
SUBJECT
Thema
MODEM FOR IEEE802.15.4 (ZIGBEE)
“ZigBee” Modem“ (IEEE802.15.4)
PAGE
Seite 2 of 29
CUSTOMER’S CODE
ETRX2
PANASONIC’S CODE
ENWC9A0xyzE
DATE
Datum
01.08.2006
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
TABLE OF CONTENTS
1.
Key Features...................................................................................................................4
2. Applications for the Module.............................................................................................4
3. Description of the Module................................................................................................5
3.1. On board DC Regulator .........................................................................................5
3.2. On Board reference Crystal ...................................................................................5
4. Scope of this Document ..................................................................................................6
5. History for this Document................................................................................................6
6. Terminal Layout...............................................................................................................7
7. Block Diagram...............................................................................................................10
8. Key Parts List ................................................................................................................10
9. Test Conditions .............................................................................................................10
10. Absolute Maximum Ratings...........................................................................................11
11. Operating Conditions.....................................................................................................11
12. DC Electrical Characteristics.........................................................................................12
13. A/D converter Characteristics........................................................................................13
14. AC Electrical Characteristics.........................................................................................13
15. Mechanical Requirements.............................................................................................15
16. Soldering Temperature-time profile (for reflow soldering).............................................16
16.1. For lead solder .....................................................................................................16
16.2. For lead free solder..............................................................................................16
17. Module Dimensions.......................................................................................................17
18. Foot Print of the Module................................................................................................17
19. Labeling Drawing...........................................................................................................18
20. Recommended Land Pattern ........................................................................................18
21. Software ........................................................................................................................19
21.1. Software Declaration............................................................................................19
21.2. Software Tools .....................................................................................................19
21.3. Ember ZigBee
TM
Stack.........................................................................................20
22. Reliability Tests .............................................................................................................20
23. Application Notes ..........................................................................................................20
23.1. Cautions for safety ...............................................................................................20
23.2. Design engineering notes ....................................................................................21
23.3. Storage conditions ...............................................................................................22
24. Packaging......................................................................................................................23
24.1. Embossed tape / Blistergurt.................................................................................23
24.2. Component direction............................................................................................24
24.3. Reel dimension ....................................................................................................24