User Manual
Table Of Contents
- 1 SCOPE OF THIS DOCUMENT
- 2 KEY FEATURES
- 3 BLUETOOTH LOW ENERGY
- 4 APPLICATIONS FOR THE MODULE
- 5 DESCRIPTION FOR THE MODULE
- 6 DETAILED DESCRIPTION
- 7 BLUETOOTH FEATURES
- 8 BLOCK DIAGRAM
- 9 TEST CONDITIONS
- 10 GENERAL DEVICE REQUIREMENTS AND OPERATION
- 11 BLUETOOTH RF PERFORMANCE
- 12 SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
- 13 MODULE DIMENSION
- 14 PAN1026 FOOTPRINT OF THE MODULE
- 15 CASE MARKING
- 16 MECHANICAL REQUIREMENTS
- 17 RELIABILITY TESTS
- 18 CAUTIONS
- 19 PACKAGING
- 20 ORDERING INFORMATION
- 21 INFORMATION REGARDING SOFTWARE VERSIONS
- 22 SOFTWARE
- 23 SOFTWARE BLOCK DIAGRAM
- 24 ROHS AND REACH DECLARATION
- 25 DATA SHEET STATUS
- 26 HISTORY FOR THIS DOCUMENT
- 27 RELATED DOCUMENTS
- 28 GENERAL INFORMATION
- 29 REGULATORY INFORMATION
- 30 INDUSTRY CANADA CERTIFICATION
- 31 EUROPEAN R&TTE DECLARATION OF CONFORMITY
- 32 LIFE SUPPORT POLICY
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-1026-2400-102
REV.
0.3
SUBJECT
CLASS 2 BLUETOOTH LOW ENERGY
SPP MODULE
PAGE 19 of 35
CUSTOMER’S CODE
PAN1026
PANASONIC’S CODE
ENW89837AxKF
DATE 02.10.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
15 CASE MARKING
No. Remark
1 Marking for Pin 1 (Circle 0,15 mm)
2
2D-Code, for internal usage only and
can be change without any notice
3 Marking definition see chapter 15.1
2
3
1
15.1 EXAMPLE FOR MARKING
PAN1026 HW/SW
ENW89837A3KF
YYWWD L L
FCCID: T7VPAN10
15.2 MARKING DEFINITION
(1) Pin1 marking
(2) 2D code (Serial number)
(3) Marking:
PAN1026 (Model Name), HW/SW (Hardware/
Software version)
ENW89837AxKF (Part Number, refer to chapter 20 Ordering Information)
Lot code (YearYear, WeekWeek, D
ay, LotLot)
ES (Engineering Sample marking)
16 MECHANICAL REQUIREMENTS
No. Item Limit Condition
1 Solderability
More than 75% of the soldering area shall be
coated by solder
Reflow soldering with
recommendable temperature profile
2
Resistance to soldering
heat
It shall be satisfied electrical requirements and not
be mechanical damage