Technical Bulletin
Key Features Benefits
The Panduit
®
StructuredGround
™
Direct Burial Compression
Grounding System provides the highest performance and
most reliable compression connection in the industry.
This system offers the speed and safety of a compression
connection, while complying with the industry requirements
of IEEE Std. 837. The fully inspectable system that is UL 467
Listed and CSA 22.2 Certified, ensures that the installed product
operates safely. Wide range-taking and universal designs
provide installation flexibility with a minimum number of parts,
reducing procurement and inventory costs. Innovative features
assure a high quality bond, reducing labor costs and improving
crimp quality.
StructuredGround
™
Direct Burial
Compression Grounding System
Meets IEEE Std 837
Offers the speed and safety of a compression connection through patented crimp
technology for maximum reliability. Compliant to IEEE837, Rev 2002 and 2014.*
Slotted tap design and
locator die
Speeds installation time, reduces labor costs and improves crimp quality
Oil and Gas Industrial Facilities Cell Towers Construction
Applications
Pre-applied conductive
antioxidant compound
Ensures a high quality mechanical and electrical bond, speeding installation
Wide range-taking ability
and multi-conductor designs
Provide design and installation flexibility with a minimum number of parts, reduce
procurement costs, ease inventory management, and improve availability to meet
critical project schedules
Compression connection
Non-flammable process that installs quickly and safely in any weather condition
Exceeds UL 467 and CSA 22.2 with
Panduit or industry standard crimping
tools and Panduit crimping dies
Standards compliance and full inspectability ensures that the installed product
operates safely, while reducing installation tool costs and providing convenience
Complies with
MIL-STD-202G (METHOD 201A)
Reliable performance in high vibration environments
B
RATED
D
Product Bulletin
*Contact Customer Service (cs@panduit.com) for specifics on compliance to IEEE837-2014.