Datasheet

PAGE . 1
January 02,2012-REV.08
1SMB3EZ4.7 SERIES
FEATURES
• Low profile package
Built-in strain relief
Glass passivated junction
• Low inductance
Plastic package has Underwriters Laboratory Flammability
Classification 94V-O
High temperature soldering : 260°C /10 seconds at terminals
Lead free in compliance with EU RoHS 2011/65/EU directive
MECHANICAL DATA
Case: JEDEC DO-214AA, Molded plastic over passivated junction
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity : Color band denotes cathode end
Standard packing: 12mm tape (E1A-481)
Weight: 0.0032 ounce, 0.092 gram
GLASS PASSIVATED JUNCTION SILICON ZENER DIODES
VOLTAGE
4.7 to 51 Volt
POWER
3 Watt
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol Value Units
Steady State Power Dissipation at T
L
=75
O
C (Note 1)
P
D
3.0 W atts
Peak Forward Surge Current 8.3ms single half sine-wave
superimposed on rated load (JEDEC method)
I
FSM
15 Amps
Operating Junction and Storage Temperature Range
T
J
,T
STG
-55 to + 150
O
C
NOTE :
1. Mounted on infinite heatsink.
1
2
Cathode
Anode
0.083(2.11)
0.075(1.91)
0.185(4.70)
0.160(4.06)
0.096(2.44)
0.083(2.13)
0.050(1.27)
0.030(0.76)
0.220(5.59)
0.200(5.08)
0.012(0.305)
0.006(0.152)
0.155(3.94)
0.130(3.30)
Green molding compound as per IEC61249 Std. . (Halogen Free)

Summary of content (6 pages)