Functional description OVERVIEW Particle's Internet of Things hardware development kit, the Photon, provides everything you need to build a connected product. Particle combines a powerful ARM Cortex M3 micro-controller with a Broadcom Wi-Fi chip in a tiny thumbnail-sized module called the PØ (P-zero). To get you started quickly, Particle adds a rock solid 3.3VDC SMPS power supply, RF and user interface components to the PØ on a small single-sided PCB called the Photon.
Interfaces BLOCK DIAGRAM
POWER Power to the Photon is supplied via the on-board USB Micro B connector or directly via the VIN pin. If power is supplied directly to the VIN pin, the voltage should be regulated between 3.6VDC and 5.5VDC. When the Photon is powered via the USB port, VIN will output a voltage of approximately 4.8VDC due to a reverse polarity protection series schottky diode between V+ of USB and VIN. When used as an output, the max load on VIN is 1A.
FCC APPROVED ANTENNAS Antenna Type Manufacturer MFG. Part # Dipole antenna LumenRadio Chip antenna 104-1001 Gain 2.15dBi Advanced Ceramic X AT7020-E3R0HBA 1.3dBi PERIPHERALS AND GPIO The Photon has ton of capability in a small footprint, with analog, digital and communication interfaces.
JTAG AND SWD Pin D3 through D7 are JTAG interface pins. These can be used to reprogram your Photon bootloader or user firmware image with standard JTAG tools such as the ST-Link v2, J-Link, R-Link, OLIMEX ARM-USB-TINI-H, and also the FTDI-based Particle JTAG Programmer. If you are short on available pins, you may also use SWD mode which requires less connections.
EXTERNAL COEXISTENCE INTERFACE Note: Currently this interface is unsupported. If you need this feature for a product, please contact Particle. The Photon supports coexistence with Bluetooth and other external radios via the three gold pads on the top side of the PCB near pin A3. These pads are 0.035" square, spaced 0.049" apart. This spacing supports the possibility of tacking on a small 1.25mm - 1.27mm pitch 3-pin male header to make it somewhat easier to interface with.
Memory Map STM32F205RGY6 FLASH LAYOUT OVERVIEW Bootloader (16 KB) DCT1 (16 KB), stores Wi-Fi credentials, keys, mfg info, system flags, etc..
led mirror 3663 96 led theme 3759 64 reserved2 3823 435 Note: Writing 0xFF to offset 34 (DEFAULT) or 3106 (ALTERNATE) will cause the device to regenerate a new private key on the next boot. Alternate keys are currently unsupported on the Photon but are used on the Electron as UDP/ECC keys. You should not need to use this feature unless your keys are corrupted. // Regenerate Default Keys echo -en "\xFF" > fillbyte && dfu-util -d 2b04:d006 -a 1 -s 34 -D fillbyte // Regenerate Alternate Keys echo -en
Pin and button definition PIN MARKINGS
PIN DESCRIPTION Pin Description This pin can be used as an input or output. As an input, supply 3.6 to 5.5VDC to power the Photon. When VIN RST VBAT the Photon is powered via the USB port, this pin will output a voltage of approximately 4.8VDC due to a reverse polarity protection series Schottky diode between VUSB and VIN. When used as an output, the max load on VIN is 1A. Active-low reset input. On-board circuitry contains a 1k ohm pull-up resistor between RST and 3V3, and 0.
PINOUT DIAGRAMS Notes: [1] MICRO_SPI_SSN is only for reference as a PØ module pin name. It is technically speaking the STM32 pin PA4 which is the SS pin in an hardware SPI driven sense, however in the Particle API SPI SS is only user controlled as a GPIO. The hardware SS pin is not implemented. The default SS pin for the Particle SPI API is A2 (STM32 pin PC2), but any GPIO can be used for this function with SPI.begin(pin).
Technical specification ABSOLUTE MAXIMUM RATINGS Parameter Symbol Supply Input Voltage Min Typ Max Unit VVIN-MAX +6.5 V Supply Output Current IVIN-MAX-L 1 A Supply Output Current I3V3-MAX-L 100 mA Storage Temperature Tstg +85 °C Enable Voltage VEN VVIN+0.6 V 2 kV -40 ESD Susceptibility HBM (Human Body Mode) VESD RECOMMENDED OPERATING CONDITIONS Parameter Symbol Min Typ Supply Input Voltage VVIN +3.6 Supply Input Voltage V3V3 +3.0 Supply Output Voltage VVIN +4.
Modulation DSSS, CCK, OFDM, BPSK, QPSK, 16QAM, 64QAM PØ module Wi-Fi output power Typ. RF Average Output Power, 802.11b CCK Mode 1M Tol. Unit Avail. upon request +/- 1.5 dBm 11M - +/- 1.5 dBm RF Average Output Power, 802.11g OFDM Mode 6M - +/- 1.5 dBm - +/- 1.5 dBm RF Average Output Power, 802.11n OFDM Mode MCS0 - +/- 1.5 dBm MCS7 - +/- 1.5 dBm 54M I/O CHARACTERISTICS These specifications are based on the STM32F205RGY6 datasheet, with reference to Photon pin nomenclature.
[3] With a minimum of 100mV. [4] Leakage could be higher than max. if negative current is injected on adjacent pins. [5] Pull-up and pull-down resistors are designed with a true resistance in series with switchable PMOS/NMOS. This PMOS/NMOS contribution to the series resistance is minimum (~10% order).
Mechanical specifications DIMENSIONS AND WEIGHT Headers Dimensions in inches (mm) Weight With 1.44 x 0.8 x 0.27 (36.58 x 20.32 x 6.86) 5 grams Without 1.44 x 0.8 x 0.17 (36.58 x 20.32 x 4.32) 3.7 grams MATING CONNECTORS The Photon (with headers) can be mounted with (qty 2) 12-pin single row 0.1" female headers. Typically these are 0.335" (8.5mm) tall, but you may pick a taller one if desired.
RECOMMENDED PCB LAND PATTERN (PHOTON WITHOUT HEADERS) The Photon (without headers) can be surface mounted directly in an end application PCB using the following PCB land pattern: TOP THROUGH VIEW In addition to the 24 pins around the outside of the Photon, there are 7 pads on the bottom the Photon PCB that can be used to connect to extra signals: RGB LED outputs, SETUP button, SMPS enable line and USB D+/D-. Photon Pins #25-31 are described in the Pin out diagrams.
Schematic SCHEMATIC - USB SCHEMATIC - POWER SCHEMATIC - USER I/O
SCHEMATIC - RF SCHEMATIC - PØ WI-FI MODULE
Layout PHOTON V1.0.0 TOP LAYER (GTL) PHOTON V1.0.
PHOTON V1.0.0 3V3 LAYER (G15L) PHOTON V1.0.
Recommended solder reflow profile Phase Temperatures and Rates A-B. Ambient~150°C, Heating rate: < 3°C/s B-C. 150~200°C, soak time: 60~120 s C-D. 200~245°C, Heating rate: < 3°C/s D. Peak temp.: 235~245°C, Time above 220°C: 40~90 s D-E.
Bill of Materials BUILD YOUR OWN DESIGN BASED ON THE PHOTON! Minimum Qty Device Specification Package/Case Part Designator MFG. MFG. PN 1 ANTENNA 2.4GHz Ceramic 5.0mm × 2.0mm x ANT1 Advanced Ceramic AT7020-E3R0HBA 2.6mm 2 6 2 4 3 CERAMIC 22uF Ceramic 6.3V CAPACITOR 10% X5R CERAMIC CAPACITOR 0.1uF Ceramic 6.3V 10% X5R CERAMIC 100pF Ceramic CAPACITOR 6.3V 10% X5R CERAMIC 10uF Ceramic 6.3V CAPACITOR 10% X5R CERAMIC CAPACITOR 10pF Ceramic 6.
Ordering information Photons are available from store.particle.io in single quantities with and without headers, and also included in different maker kits.
Qualification and approvals Photon with Headers Model Number: PHOTONH RoHS CE FCC ID: 2AEMI-PHOTON IC: 20127-PHOTON Photon without Headers Model Number: PHOTONNOH RoHS CE FCC ID: 2AEMI-PHOTON IC: 20127-PHOTON
Product handling PACKAGING The Photon comes in two primary styles of packaging: Matchbox and Kit Box. The matchbox packaging contains the bare essentials to get you started, while the Photon Kit contains a breadboard, Micro B USB cable, sticker, prototyping card and a couple sensors to build your first Internet connected project! Photons without headers in matchbox packaging are also available in JEDEC style trays for automated pick and place machines.
Default settings The Photon comes preprogrammed with a bootloader and a user application called Tinker. This application works with an iOS and Android app also named Tinker that allows you to very easily toggle digital pins, take analog and digital readings and drive variable PWM outputs. The bootloader allows you to easily update the user application via several different methods, USB, OTA, Serial Y-Modem, and also internally via the Factory Reset procedure.
Glossary SMPS Switched-Mode Power Supply RF Radio Frequency Castellated The edge of the PCB has plated holes that are cut in half which resemble the top of a castle. These make it easy to solder the Photon down to another PCB with a SMT reflow process. SMT Surface Mount Technology (often associated with SMD which is a surface mount device). AP Access Point LED Light-Emitting Diode RGB LED Red green and blue LEDs combined and diffused in one package.
FCC IC CE Warnings and End Product Labeling Requirements Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
Canada Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: 1.
Revision history Revision Date - 30-March2015 BW Initial release v003 7-April-2015 BW Updated template v004 8-April-2015 BW Updated Overview, Block diagram, Power, RF, and Pin markings sections v005 9-April-2015 BW Updated BOM v006 21-April2015 Author Comments BW Added JTAG, BT CO-EX, I/O Characteristics, Schematic, Layout, Reflow Profile, Glossary, Updated Operating Conditions v007 28-April2015 BW Added Layout, Updated analog pins, Land patterns, Packaging, Mating Connectors v008
Known Errata We are tracking known errata with this datasheet here. These issues/errors in the datasheet will be resolved in subsequent revisions.
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