DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D188 BGY148A; BGY148B HF amplifier modules Product specification Supersedes data of 1997 Jul 14 1998 May 13
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B PINNING - SOT421A FEATURES • Single 6 V nominal supply voltage PIN DESCRIPTION • 3 W output power 1 RF input • Easy control of output power by DC voltage 2 VC • Silicon bipolar technology 3 VS 4 RF output • Standby current less than 100 µA. Flange ground APPLICATIONS • Portable communication equipment operating in the 400 to 440 MHz and 430 to 488 MHz frequency ranges respectively.
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B CHARACTERISTICS ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; VC ≤ 3.5 V; Tmb = 25 °C; unless otherwise specified. SYMBOL f PARAMETER CONDITIONS MIN. TYP. MAX. UNIT frequency range BGY148A 400 − 440 MHz BGY148B 430 − 488 MHz − − 100 µA IQ total quiescent current VC = 0; PD = 0 adjust VC for PL = 3 W − − 500 µA 3 − − W 24.
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD553 5 MGD554 60 handbook, halfpage handbook, halfpage PL (W) η (%) 400 MHz 4 440 MHz 440 MHz 400 MHz 40 3 2 20 1 0 0 0 1 2 3 VC (V) 4 0 ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C. Fig.3 1 2 3 PL (W) 4 ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C. Load power as a function of control voltage; BGY148A; typical values. Fig.
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD557 4 handbook, halfpage VC (V) MGD558 −30 3.0 VSWRin H2, H3 (dBc) 2.5 3 −40 H3 VSWRin 2.0 2 H2 VC −50 1 1.5 0 380 420 400 −60 380 1.0 460 440 ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C. Fig.7 Fig.8 MDA206 handbook, halfpage PL (W) 4 400 MHz 440 MHz 3 2 1 0 −25 0 25 50 75 100 Tmb (oC) ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C. Fig.
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD559 5 MGD560 60 handbook, halfpage handbook, halfpage PL (W) 4 430 MHz η (%) 430 MHz 488 MHz 40 488 MHz 3 2 20 1 0 0 0 1 2 3 VC (V) 4 0 ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C. 1 2 3 PL (W) 4 ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C. Fig.10 Load power as a function of control voltage; BGY148B; typical values. Fig.
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD563 4 handbook, halfpage VC (V) H2, H3 (dBc) VSWRin 3 2.5 −40 2.0 −50 H2 VC 2 MGD564 −30 3.0 H3 VSWRin 1 −60 1.5 0 420 460 440 −70 420 1.0 500 480 ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C. MDA205 PL (W) 4 430 MHz 488 MHz 2 1 0 −25 0 25 50 75 100 Tmb (oC) ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C. Fig.
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B SOLDERING The indicated temperatures are those at the solder interfaces. MGM159 300 handbook, halfpage Advised solder types are types with a liquidus less than or equal to 210 °C. T (°C) Solder dots or solder prints must be large enough to wet the contact areas. 200 Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens.
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B 22.6 handbook, full pagewidth DETAIL 2 0.4 0.8 1.7 2 1.5 8.45 1 2.9 2.7 0.6 2.7 1.1 0.1 2.6 2.4 0.1 7.48 DETAIL 15.1 0.5 0.7 20.18 footprint metallization solder area. 21.8 handbook, full pagewidth 2 0.8 2 2 7.05 1.7 1.8 2 7.08 14.7 MGK392 19.78 solder area. Dimensions in mm. Fig.18 SOT421A footprint. 1998 May 13 1.1 9 3.
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B PACKAGE OUTLINE Ceramic single-ended flat package; 4 in-line leads SOT421A U D A y Z E U1 L Q 1 2 3 4 b e1 e d w M c e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c D d E e e1 L Q U U1 w y Z mm 3.0 2.6 0.56 0.46 0.30 0.20 22.1 21.7 2.4 2.0 13.4 13.0 5.08 7.62 0.7 0.3 3.4 3.0 22.4 22.0 8.2 7.8 0.25 0.15 0.25 0.
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
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