INTEGRATED CIRCUITS DATA SHEET TDA5051A Home automation modem Product specification Supersedes data of 1997 Sep 19 File under Integrated Circuits, IC11 1999 May 31
Philips Semiconductors Product specification Home automation modem TDA5051A FEATURES APPLICATIONS • Full digital carrier generation and shaping • Home appliance control (air conditioning, shutters, lighting, alarms and so on) • Modulation/demodulation frequency set by clock adjustment, from microcontroller or on-chip oscillator • Energy/heating control • High clock rate of 6-bit A/D (Digital to Analog) converter for rejection of aliasing components • Amplitude Shift Keying (ASK) data transmission
Philips Semiconductors Product specification Home automation modem TDA5051A ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA5051AT SO16 DESCRIPTION VERSION plastic small outline package; 16 leads; body width 7.
Philips Semiconductors Product specification Home automation modem TDA5051A PINNING SYMBOL PIN DESCRIPTION DATAIN 1 digital data input (active LOW) DATAOUT 2 digital data output (active LOW) VDDD 3 digital supply voltage CLKOUT 4 clock output DGND 5 digital ground SCANTEST 6 test input (LOW in application) OSC1 7 oscillator input OSC2 8 oscillator output APGND 9 analog ground for power amplifier TXOUT 10 analog signal output VDDAP 11 analog supply voltage for power amp
Philips Semiconductors Product specification Home automation modem TDA5051A The DAC and the power stage are set in order to provide a maximum signal level of 122 dBµV (RMS) at the output. After digital demodulation, the baseband data signal is made available after pulse shaping. The output of the power stage (TXOUT) must always be connected to a decoupling capacitor, because of a DC level of 0.5VDD at this pin, which is present even when the device is not transmitting.
Philips Semiconductors Product specification Home automation modem TDA5051A CHARACTERISTICS VDDD = VDDA = 5 V ±5%; Tamb = 0 to 70 °C; VDDD connected to VDDA; DGND connected to AGND. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDD supply voltage 4.75 5 5.
Philips Semiconductors Product specification Home automation modem SYMBOL PARAMETER TDA5051A CONDITIONS MIN. TYP. MAX. UNIT tW(DI)(min) minimum pulse width of DATAIN signal fosc = 8.48 MHz; see Fig.
Philips Semiconductors Product specification Home automation modem SYMBOL PARAMETER TDA5051A CONDITIONS MIN. TYP. MAX. UNIT Power-up timing td(pu)(TX) delay between power-up and DATAIN in transmission mode − XTAL = 8.48 MHz; C1 = C2 = 27 pF; Rp = 2.2 MΩ; see Fig.10 1 − µs td(pu)(RX) delay between power-up and DATAOUT in reception mode XTAL = 8.48 MHz; C1 = C2 = 27 pF; Rp = 2.2 MΩ; fRXIN = 132.5 kHz; 120 dBµV sine wave; see Fig.
Philips Semiconductors Product specification Home automation modem TDA5051A 1500 Hz MBH664 −10 handbook, full pagewidth 20 dB dBV (RMS) −60 117.5 132.5 f (kHz) Resolution bandwidth = 100 Hz; B−20dB = 3000 Hz (2 × 1500 Hz). Fig.4 Shaped signal spectrum. handbook, full pagewidth VRXIN modulated sine wave 122 dBµV amplitude V(I) 0 t GAGC +30 dB 8.68 dB AGC range −6 dB tc(AGC) (AGC time constant) MGK011 Fig.5 AGC time constant definition (not to scale). 1999 May 31 9 147.
Philips Semiconductors Product specification Home automation modem TDA5051A TIMING Configuration for clock handbook, full pagewidth OSC1 CLKOUT XTAL 7 fosc MICROCONTROLLER TDA5051A DGND 5 GND MGK835 For parameter description, see Table 1. Fig.6 External clock. handbook, full pagewidth CLKIN CLKOUT 1/2 f osc 4 MICROCONTROLLER GND 8 TDA5051A DGND 5 C1 OSC2 Rp 7 OSC1 XTAL C2 MGK836 For parameter description, see Table 1. Fig.7 Typical configuration for on-chip clock circuit.
Philips Semiconductors Product specification Home automation modem Table 1 TDA5051A Clock oscillator parameters OSCILLATOR FREQUENCY fosc CARRIER FREQUENCY fcr CLOCK OUTPUT FREQUENCY 1⁄ f 2 osc 6.080 to 9.504 MHz 95 to 148.5 kHz 3.040 to 4.752 MHz Table 2 EXTERNAL COMPONENTS C1 = C2 = 27 to 47 pF; Rp = 2.2 to 4.
Philips Semiconductors Product specification Home automation modem handbook, full pagewidth TDA5051A tW(burst) TXOUT tW(burst)(min) VO(DC) th tsu 0 tW(DI)(min) tW(DI) DATAIN (1) (2) (3) MGK837 (1) tW(DI) > tW(DI)(min). 1 (2) tW(DI)(min) = tsu + ----f cr (3) tW(DI)(min) < tsu; wrong operation. Fig.8 Relationship between DATAIN and TXOUT (see Table 3).
Philips Semiconductors Product specification Home automation modem TDA5051A Timing diagrams handbook, full pagewidth 90% VDD VDD NOT DEFINED CLKOUT CLOCK STABLE HIGH DATAIN TXOUT td(pu)(TX) MGK015 DATAIN is an edge-sensitive input and must be HIGH before starting a transmission. Fig.10 Timing diagram during power-up in transmission mode. handbook, full pagewidth 90% VDD VDD CLKOUT NOT DEFINED CLOCK STABLE RXIN DATAOUT NOT DEFINED HIGH td(pu)(RX) td(dem)(h) MGK016 Fig.
Philips Semiconductors Product specification Home automation modem TDA5051A handbook, full pagewidth PD DATAIN TXOUT td(pd)(TX) normal operation wrong operation TXOUT delayed by PD MGK017 Fig.12 Power-down sequence in transmission mode. handbook, full pagewidth PD RXIN DATAOUT td(dem)(su) td(pd)(RX) td(pd)(RX) MGK018 DATAOUT delayed by PD Fig.13 Power-down sequence in reception mode. handbook, full pagewidth PD RXIN DATAOUT tactive(min) T IDD(RX) IDD IDD(PD) 0 MGK845 Fig.
Philips Semiconductors Product specification Home automation modem TDA5051A TEST INFORMATION handbook, full pagewidth DATAIN pulse generator 300 Hz 50% 1 10 TXOUT 1 µF TDA5051A DATAOUT (to be tested) 2 14 7 Y1 RXIN 10 nF 8 30 Ω Y2 XTAL fosc OSCILLOSCOPE DATAIN TXOUT/RXIN DATAOUT td(dem)(su) td(dem)(h) MGK838 Fig.15 Test set-up for measuring demodulation delay.
Philips Semiconductors Product specification Home automation modem TDA5051A coupling network(3) handbook, full pagewidth OSC1 10 7 TXOUT 8 12, 5, 9 1 33 nF 47 µH 47 µH 33 nF TDA5051A OSC2 10 µF CISPR16 network(4) AGND, DGND, APGND 250 nF 50 µH 50 Ω 13, 3, 11 DATAIN 5Ω VDDA, VDDD, VDDAP 250 nF (1) (2) +5 V POWER SUPPLY 50 µH 5Ω SPECTRUM ANALYSER 50 Ω MGK839 (1) (2) (3) (4) Square wave TTL signal 300 Hz, duty factor = 50% for measuring signal bandwidth (see spectrum Fig.3).
Philips Semiconductors Product specification Home automation modem handbook, full pagewidth 10 TDA5051A TXOUT in out COUPLING NETWORK (1) TDA5051A 1 7 8 OSC1 DATAIN 12, AGND, DGND, APGND 5, 9 + + SPECTRUM ANALYSER 50 Ω OSC2 out WHITE NOISE GENERATOR XTAL = 8.
Philips Semiconductors Product specification Home automation modem TDA5051A APPLICATION INFORMATION handbook, full pagewidth 250 V (AC) max T 630 mA 47 nF/X2 250 V (AC) 2 µF 250 V (AC) MOV 250 V (AC) 68 Ω (2 W) +5 V 1 78L05 1N4006 3 2 7V5 (1.3 W) 470 µF (16 V) DATAOUT MICROCONTROLLER 3 VDDAP 11 VDDA 13 1 14 2 TDA5051A CLKOUT PD 47 µH 1 µF (16 V) VDDD DATAIN 1N4006 100 µF (16 V) 47 nF +5 V 47 nF (63 V) 1 mH 47 µH low RS 10 4 15 RXIN 10 nF TXOUT SA5.
Philips Semiconductors Product specification Home automation modem TDA5051A MBH907 20 handbook, full pagewidth 103 gain (dB) 0 input impedance (Ω) −20 −40 102 1 −60 2 −80 −100 10 102 103 104 105 106 f (Hz) 10 107 Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the sampling frequency (1⁄2fosc). Input impedance always higher than 10 Ω within the 95 to 148.5 kHz band. Fig.
Philips Semiconductors Product specification Home automation modem TDA5051A handbook, full pagewidth 250 V (AC) max 470 nF/X2 250 V (AC) T 630 mA MOV 250 V (AC) 100 Ω (0.
Philips Semiconductors Product specification Home automation modem TDA5051A handbook, full pagewidth 250 V (AC) max T 630 mA 2 µF 250 V (AC) MOV 250 V (AC) 47 nF/X2 250 V (AC) 68 Ω (2 W) +5 V 1 mH 1 78L05 7V5 (1.
Philips Semiconductors Product specification Home automation modem TDA5051A handbook, full pagewidth 250 V (AC) max 470 nF/X2 250 V (AC) T 630 mA MOV 250 V (AC) 100 Ω (0.
Philips Semiconductors Product specification Home automation modem TDA5051A PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.
Philips Semiconductors Product specification Home automation modem TDA5051A If wave soldering is used the following conditions must be observed for optimal results: SOLDERING Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology.
Philips Semiconductors Product specification Home automation modem TDA5051A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable suitable(2) suitable suitable suitable LQFP, QFP, TQFP not recommended(3)(4) suitable SSOP, TSSOP, VSO not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive.
Philips Semiconductors Product specification Home automation modem TDA5051A NOTES 1999 May 31 26
Philips Semiconductors Product specification Home automation modem TDA5051A NOTES 1999 May 31 27
Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd.
