Data Sheet

Packaging and labeling VL53L1X
32/35 DocID031281 Rev 2
Note: As the VL53L1X package is not sealed, only a dry reflow process should be used (such as
convection reflow). Vapor phase reflow is not suitable for this type of optical component.
The VL53L1X is an optical component and as such, it should be treated carefully. This
would typically include using a ‘no-wash’ assembly process
8.6 Handling and storage precautions
8.6.1 Shock precaution
Sensor modules house numerous internal components that are susceptible to shock
damage. If a unit is subject to excessive shock, is dropped on the floor, or a tray/reel of units
is dropped on the floor, it must be rejected, even if no apparent damage is visible.
8.6.2 Part handling
Handling must be done with non-marring ESD safe carbon, plastic, or teflon tweezers.
Ranging modules are susceptible to damage or contamination. The customer is advised to
use a clean assembly process after removing the tape from the parts, and until a protective
cover glass is mounted.
8.6.3 Compression force
A maximum compressive load of 25 N should be applied on the module.
8.6.4 Moisture sensitivity level
Moisture sensitivity is level 3 (MSL) as described in IPC/JEDEC JSTD-020-C
8.7 Storage temperature conditions
Table 19. Recommended storage conditions
Parameter Min. Typ. Max. Unit
Temperature (storage) -40 23 85 °C